A thermal resistance performance detection system and detection method of a thermally conductive material

Abstract

The invention discloses a detection system and a detection method for thermal resistance performance of a heat conduction material. The detection system comprises a temperature control platform, a semiconductor heating device, a heating circuit, a heat dissipation detection circuit and switching circuits. The temperature control platform is used for placing a to-be-detected heat conduction material and adjusting the temperature; the semiconductor heating device is arranged above the temperature control platform for feeding back a relationship between temperature and voltage in a test loop, converting the temperature into voltage for quantification and using as a thermal resistance detection basis; the heating circuit is respectively electrically connected with the two ends of the semiconductor heating device; the heat dissipation detection circuit is respectively electrically connected with the two ends of the semiconductor heating device; the switching circuits are arranged between the heating circuit and the semiconductor heating device and between the heat dissipation detection circuit and the semiconductor heating device for controlling one of the heating circuit and the heat dissipation detection circuit to communicate with the semiconductor heating device. A thermal resistance performance detection method for the heat conduction material based on the performance detectionsystem is provided, thereby realizing accurate detection and repeated detection of the thermal resistance performance of the heat conduction material.

Description

technical field [0001] The embodiments of the present invention relate to a heat conduction material performance detection technology, and in particular to a heat conduction material thermal resistance performance detection system and detection method. Background technique [0002] With the development of power electronics technology, more and more high-power and ultra-high-power devices are being used. Solving the heat dissipation problem of devices has become the key to the development of power electronic devices. The heat dissipation material in the package structure is the main heat dissipation channel for power electronic devices, so it is very important to select materials with excellent thermal conductivity as the package body of the device. [0003] Most of the methods for measuring the thermal resistance of thermally conductive materials in the prior art are mostly through such as Figure 1a The shown structure is realized, including a heating unit 10, a heat-conduc...

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Problems solved by technology

[0004] In the thermal resistance measurement method used in the prior art, the heat of the workbench 30 cannot be dissipated in time, and the temperature tends to accumulate and rise, resulting in inaccurate temperature testing and calculation of the thermal conductivity of the heat-conducting material after the temperature of the heating unit 10 and the workbench 30 are stable. , leading to errors in the measurement results

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