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A thermal resistance performance detection system and detection method of a thermally conductive material

A technology of thermal conductive material and detection system, applied in the direction of thermal development of materials, etc., can solve the problems that the heat of the workbench cannot be dissipated in time, the thermal conductivity is inaccurate, and the temperature is easy to accumulate and rise.

Active Publication Date: 2021-03-26
SHANGHAI IND U TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the thermal resistance measurement method used in the prior art, the heat of the workbench 30 cannot be dissipated in time, and the temperature tends to accumulate and rise, resulting in inaccurate temperature testing and calculation of the thermal conductivity of the heat-conducting material after the temperature of the heating unit 10 and the workbench 30 are stable. , leading to errors in the measurement results

Method used

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  • A thermal resistance performance detection system and detection method of a thermally conductive material
  • A thermal resistance performance detection system and detection method of a thermally conductive material
  • A thermal resistance performance detection system and detection method of a thermally conductive material

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Embodiment 1

[0038] figure 2 Shown is a schematic structural diagram of a thermal resistance performance detection system of a thermally conductive material provided in Embodiment 1 of the present invention. This embodiment is applicable to situations where the thermal resistance performance of a thermally conductive material needs to be tested, such as selecting a thermally conductive material with excellent thermal conductivity. The specific structure of the thermal resistance performance detection system of the thermal conductive material is as follows:

[0039] A detection system for the thermal resistance performance of a thermally conductive material, comprising:

[0040] The temperature control platform 210 is used to place the thermally conductive material 260 to be detected and adjust the temperature;

[0041] Exemplarily, the thermally conductive material 260 to be detected is placed on the temperature control platform 210, and the temperature control platform 210 is adjusted t...

Embodiment 2

[0056] Figure 4 Shown is a schematic structural diagram of another heat-conducting material thermal resistance performance detection system provided by Embodiment 2 of the present invention. This embodiment is based on the above-mentioned embodiment. Preferably, a A timing control module 280, the timing control module 280 is electrically connected to the control terminal of the switching circuit 250, and is used to control the switching circuit 250 to sequentially conduct one of the heating circuit 230 and the heat dissipation detection circuit 240 with the semiconductor heating device 220 according to a preset time interval .

[0057] Exemplarily, the time interval of the timing control module 280 is set to t1, the number of switching times is n, and the initial state is artificially set: the heating circuit 230 and the semiconductor heating device 220 are turned on, then after the time interval t1, the timing control module 280 controls the switching circuit 250 to operate...

Embodiment 3

[0061] Figure 5a The third embodiment of the present invention provides a flow chart of a thermal resistance performance detection method for thermal conductive materials based on the thermal resistance performance detection system provided in the above embodiments. This embodiment can be applied to select In the case where it is necessary to test the thermal resistance of the thermally conductive material, the method can be performed by the above-mentioned thermal resistance performance detection system of the thermally conductive material provided by any of the above-mentioned embodiments, and specifically includes the following steps:

[0062] Step 110, obtaining the thermal resistance value of the thermal resistance performance detection system of the thermal conductive material, Figure 5b A flowchart of specific steps, including:

[0063] Step 111, obtaining the thermal conductivity of the semiconductor heating device;

[0064] Wherein, the thermal conductivity of the...

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Abstract

The invention discloses a detection system and a detection method for thermal resistance performance of a heat conduction material. The detection system comprises a temperature control platform, a semiconductor heating device, a heating circuit, a heat dissipation detection circuit and switching circuits. The temperature control platform is used for placing a to-be-detected heat conduction material and adjusting the temperature; the semiconductor heating device is arranged above the temperature control platform for feeding back a relationship between temperature and voltage in a test loop, converting the temperature into voltage for quantification and using as a thermal resistance detection basis; the heating circuit is respectively electrically connected with the two ends of the semiconductor heating device; the heat dissipation detection circuit is respectively electrically connected with the two ends of the semiconductor heating device; the switching circuits are arranged between the heating circuit and the semiconductor heating device and between the heat dissipation detection circuit and the semiconductor heating device for controlling one of the heating circuit and the heat dissipation detection circuit to communicate with the semiconductor heating device. A thermal resistance performance detection method for the heat conduction material based on the performance detectionsystem is provided, thereby realizing accurate detection and repeated detection of the thermal resistance performance of the heat conduction material.

Description

technical field [0001] The embodiments of the present invention relate to a heat conduction material performance detection technology, and in particular to a heat conduction material thermal resistance performance detection system and detection method. Background technique [0002] With the development of power electronics technology, more and more high-power and ultra-high-power devices are being used. Solving the heat dissipation problem of devices has become the key to the development of power electronic devices. The heat dissipation material in the package structure is the main heat dissipation channel for power electronic devices, so it is very important to select materials with excellent thermal conductivity as the package body of the device. [0003] Most of the methods for measuring the thermal resistance of thermally conductive materials in the prior art are mostly through such as Figure 1a The shown structure is realized, including a heating unit 10, a heat-conduc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 钱宇力单耘耘
Owner SHANGHAI IND U TECH RES INST
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