Temperature measurement method of small-diameter rod bundle component under motion condition
A temperature measurement, small diameter technology, used in thermometers, measuring devices, measuring heat, etc., can solve problems such as easy falling off of thermocouples
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[0019] The invention provides a method for measuring the temperature of small-diameter rod bundle components under moving conditions, which solves the problem that thermocouples are easy to fall off due to moving conditions in a narrow space, and can ensure accurate and stable measurement under the condition that the experimental device is in motion The temperature of the wall surface of the small-diameter rod bundle is carried out, and the related heat transfer characteristic experiment of the rod bundle is carried out.
[0020] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, under the condition of not conflicting with each other, the embodiments of the present application and the features in the embodiments can be combined with each other.
[0021] In...
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