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Head-mounted smart learning headset

A smart learning and head-mounted technology, applied in on-ear/around-ear headphones, earpieces/headphone accessories, loudspeakers, etc., can solve the problems of reducing user comfort, uncompact structure, inconvenient storage and carrying, etc. , to facilitate storage and portability, improve assembly efficiency, and improve wearing comfort

Pending Publication Date: 2019-02-15
睿贝尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the headset has the disadvantage of being bulky and inconvenient to store and carry.
Moreover, the structure of the earphone is too simple, the structure is not compact, and the layout is not reasonable enough, which greatly affects the overall performance of the headset and greatly reduces the comfort of the user.

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0020] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0021] Such as figure 1 and Figure 4 As shown, this embodiment provides a head-mounted intelligent learning earphone, including a headband assembly 1, and an earphone assembly 2 hinged to both ends of the headband assembly 1; The inner side wall is concavely provided with a hinged position 11, and the end of the earphone assembly 2 is provided with a telescopic member 3, and the connector of the telescopic member 3 exposed at the end of the earphone assembly 2 is inserted into the hinged position 11 and is connected to the hinged position 11. The hinge positions 11 are hinged; grooves are provided on the inner side walls of both ends of the headband assembly 1, and a spring band 12 is threaded in the cavity of the headband assembly 1, and the ends of the spring band 12 are extended A first hinged...

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PUM

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Abstract

The invention discloses a head-mounted smart learning headset, comprising a head hoop component and headset components mutually hinged with two ends of the head hoop component, wherein the inner sidewalls of the two end parts of the head hoop component are concavely provided with hinging positions, the end parts of the headset components are provided with telescopic pieces, and the connecting heads of the telescopic pieces exposed at the end parts of the headset components are inserted into the hinging positions and hinged with the hinging positions; the inner side walls of the two end partsof the head hoop component are provided with grooves, a spring belt is penetrated into a cavity of the head hoop component, the end parts of the spring belt extend outside the grooves and are integrally bent and provided with a first hinging wall, and the first hinging wall and the grooves form the hinging positions. According to the structural design, the wearing comfort level can be effectivelyimproved through the arrangement of an elastic belt, and meanwhile, through the mutual hinging between the hinging positions and the connecting heads of the telescopic pieces, the assembly efficiencycan be effectively improved, and the storage and carrying of the headset can be facilitated.

Description

technical field [0001] The invention relates to the technical field of earphones, in particular to a head-mounted intelligent learning earphone. Background technique [0002] In recent years, with the rapid development of science and technology and the mature development of communication transmission technology, people's daily life has become more and more inseparable from smart handheld devices. For example, more and more passengers use smart Handheld devices are used to achieve the purpose of learning, entertainment or talking with others. As the name suggests, a headset is a headset worn on the head. Regardless of the requirements for sound effects or health considerations, headsets are a good choice. Choice, so the headset has its wide applicability. However, the headset has the disadvantage of being bulky and inconvenient to store and carry. Moreover, the structure of the earphone is too simple, the structure is not compact, and the layout is not reasonable enough, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
CPCH04R1/1008H04R2201/10
Inventor 郭丽芳许睿
Owner 睿贝尔科技有限公司
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