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Connection structure formed by correspondingly superposed flexible circuit carrier plates

A circuit carrier and connection structure technology, which is applied in the structural connection of printed circuits, printed circuits, printed circuits, etc., can solve the problems of insufficient plug strength, inability to be widely used, and inability to match the connector structure.

Inactive Publication Date: 2019-03-01
ADVANCED FLEXIBLE CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using this double-sided circuit board, it is often not widely used in current thin, light and small electronic products due to the limitation of its material inflexibility.
Furthermore, limited by the structural thickness of the circuit substrate itself, it often cannot match the structure of the connector.
[0003] If a general flexible circuit (such as thin film printed electronic cable, flexible flat cable, flexible printed circuit board) is used as the connection or plug-in structure, because the flexible circuit itself has the characteristics of flexibility, Insufficient in plug strength, often unable to meet current needs

Method used

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  • Connection structure formed by correspondingly superposed flexible circuit carrier plates
  • Connection structure formed by correspondingly superposed flexible circuit carrier plates
  • Connection structure formed by correspondingly superposed flexible circuit carrier plates

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Embodiment Construction

[0064] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0065] see figure 1 As shown, it shows a schematic view of the flexible circuit carrier of the first embodiment of the present invention when unfolded, figure 2 show figure 1 Sectional view of section A-A in middle. The flexible circuit carrier 100 of the present invention includes a first flexible circuit carrier 1, a second flexible circuit carrier 2, and a flexible circuit carrier connected between the first flexible circuit carrier 1 and the second flexible circuit carr...

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Abstract

The utility model relates to a connection structure formed by correspondingly superposed flexible circuit carrier plates. The connection structure includes a first flexible circuit carrier plate, a second flexible circuit carrier plate and a bent connection part. The bending connection part is integrally connected between one side edge of the first flexible circuit carrier plate and one side edgeof the second flexible circuit carrier plate. The first flexible circuit carrier plate is folded and superimposed correspondingly toward the second flexible circuit carrier plate so that a plurality of first contact pads of the first flexible circuit carrier plate correspond to a plurality of second contact pads of the second flexible circuit carrier plate one by one. A height adjusting layer or aglue layer is arranged between the first flexible circuit carry plate and the second flexible circuit carrier plate to meet the thickness requirements in actual plug-in or weld applications.

Description

technical field [0001] The present invention relates to a connection structure of a flexible circuit, in particular to a connection structure in which a flexible circuit carrier board is laminated correspondingly. Background technique [0002] Due to its flexibility and thinness, flexible circuits have been widely used in various electronic product fields. When fabricating a plug-in or connection structure that requires upper and lower corresponding conductive contacts, it is generally considered to use a rigid circuit board as a base material and form a plurality of conductive contact pads on the upper and lower surfaces of the circuit substrate. However, when the double-sided circuit board is used, due to the limitation of its material inflexibility, it cannot be widely used in current thin, light and small electronic products. Furthermore, limited by the structural thickness of the circuit substrate itself, it often cannot match the structure of the connector. [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14
CPCH05K1/147H05K2201/058
Inventor 卓志恒苏国富
Owner ADVANCED FLEXIBLE CIRCUITS