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Double-sided module with electromagnetic shielding

A technology of shielding structure and top surface, applied in the fields of magnetic/electric field shielding, circuits, printed circuits, etc., can solve the problem of difficulty in effective shielding of module size

Pending Publication Date: 2019-04-05
QORVO US INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, as IC modules continue to be miniaturized from smaller to smaller, it becomes more difficult to create effective shielding without substantially increasing the size of the module

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  • Double-sided module with electromagnetic shielding
  • Double-sided module with electromagnetic shielding
  • Double-sided module with electromagnetic shielding

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Embodiment Construction

[0025] The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best modes for practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It is to be understood that these concepts and applications are within the scope of this disclosure and the appended claims.

[0026] It will be understood that, although the terms first, second etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present di...

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Abstract

The present invention relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The secondmold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.

Description

field of invention [0001] The present disclosure relates to a double-sided module and a method of manufacturing the same, and more particularly, to a double-sided module with electromagnetic shielding, and a method for providing the double-sided module with electromagnetic shielding. Background technique [0002] Electronic components are ubiquitous in modern society. The electronics industry proudly but routinely announces accelerated clock speeds and smaller integrated circuit modules. While the benefits of these devices are myriad, smaller and faster electronics can create problems. In particular, high clock speeds inherently require fast transitions between signal levels. Rapid transitions between signal levels generate electromagnetic emissions throughout the electromagnetic spectrum. Such emissions are regulated by the Federal Communications Commission (FCC) and other regulatory agencies. Also, fast inherently means higher frequencies. A higher frequency means a s...

Claims

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Application Information

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IPC IPC(8): H01L23/552
CPCH01L23/552H01L2225/06537H01L23/3121H01L23/3128H01L23/3135H01L23/49805H01L23/49816H01L21/561H01L24/16H01L24/48H01L24/97H01L25/0652H01L25/0657H01L25/16H01L2224/16227H01L2224/48227H01L2224/97H01L2225/0651H01L2225/06517H01L2924/15311H01L2924/19042H01L2924/19105H01L2924/19106H01L2924/3025H01L2225/06572H01L2225/06548H01L2224/81H01L2224/85H05K9/0039H05K9/0088Y10T29/49789H05K9/0022H05K2201/0707
Inventor 戴维·艾伦·扬德金斯基托马斯·斯科特·莫里斯布赖恩·霍华德·卡尔霍恩
Owner QORVO US INC
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