A pcb metal hole embedded copper structure and its processing technology

Abstract

The invention discloses a PCB metal hole copper embedding structure. The structure comprises a PCB, a first through hole, a second through hole, a third through hole, a first copper block, a second copper block and a third copper block, wherein the first through hole, the second through hole and the third through hole respectively penetrate through the PCB, the first through hole is provided witha first electroless plating copper hole wall, the second through hole is provided with a second electroless plating copper hole wall, and the third through hole is provided with a third electroless plating copper hole wall; The circumferences of the first copper block, the second copper block and the third copper block are all provided with teeth. The first copper block is embedded into the firstthrough hole provided with the first electroless plating copper hole wall, the second copper block is embedded into the second through hole provided with the second electroless plating copper hole wall, and the third copper block is embedded into the third through hole provided with the third electroless plating copper hole wall. The invention further provides a processing technology of the PCB metal hole copper embedding structure, and other copper embedding modes except the copper embedding technology of the PCB are achieved.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to a copper-embedded PCB metal hole structure and a processing technology thereof. Background technique [0002] With the diversified development of product miniaturization and high power, the conventional multi-layer flat-panel PCB can no longer bear greater heat dissipation requirements, and the existing PCB buried copper process is relatively complicated, and both sides cannot be completely exposed on the surface. Embedded during processing, the processing cycle is relatively long. Moreover, in the existing PCB copper embedding process, the embedded copper can only be press-fitted in holes without metal walls, but not embedded in metal holes. [0003] Therefore, the existing PCB buried copper process has the following defects: [0004] (1) The existing process is only manually inserted, which is slow and inefficient; [0005] (2) There are too many copper pa...

AI Technical Summary

Problems solved by technology

[0004] (1) The existing process is only manually inserted, which is slow and inefficient;

[0005] (2) There are too many copper particles embedded on a single PCB, and the cost of the buried copper process is too high

[0006] Therefore, the existing PCB board manufacturing process still needs to be improved and developed.

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