Product quality testing method and device

A technology for product quality and detection methods, applied in optical testing flaws/defects, image analysis, instruments, etc., can solve problems such as lead lift, no lead, product quality problems, etc., to reduce calculation pressure and improve accuracy Effect
CN109829883BActive Publication Date: 2020-11-17GEER TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GEER TECH CO LTD
Publication Date
2020-11-17

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Abstract

The embodiment of the invention provides a product quality detection method and device. The method comprises the steps that detection equipment generates a three-dimensional product image which corresponds to a to-be-detected product and comprises a welding spot area according to images shot by shooting equipment under different light sources and different visual angles; a measurement model for measuring the spot welding area in the three-dimensional product image is established according to an optical triangulation method; And preliminary detection is performed on the spot welding area in thethree-dimensional product image by using the measurement model. And for the to-be-detected product passing the preliminary detection, the to-be-detected product is detected again by using the first classification model. And only the to-be-detected product passing the preliminary detection is detected again, so that the calculation pressure of the detection equipment can be reduced. And then determining which defect the to-be-detected product has by using the confirmation processing logic corresponding to the at least one defect type obtained after re-detection. In the re-detection process, the used confirmation processing logic is targeted, and any person does not intervene in the whole processing process.
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Description

technical field

[0001] The invention relates to the technical field of automatic detection, in particular to a product quality detection method and device. Background technique

[0002] Soldering is a common and important process in the manufacture of electronic devices. Due to the influence of many factors such as production environment, production equipment and production process, various defects will inevitably appear in the welding process, and may further lead to product quality problems. In actual production, common defects include lead lift, no lead, lead offset and so on.

[0003] Along with the strict requirements on the processing technology in the production line, higher requirements are put forward for the detection capability of electronic device defects. Therefore, how to accurately identify whether there are defects in electronic devices is particularly important. Contents of the invention

[0004] In view of this, embodiments of the present invention pro...

Claims

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