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Product quality testing method and device

A technology for product quality and detection methods, applied in optical testing flaws/defects, image analysis, instruments, etc., can solve problems such as lead lift, no lead, product quality problems, etc., to reduce calculation pressure and improve accuracy Effect

Active Publication Date: 2020-11-17
GEER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the influence of many factors such as production environment, production equipment and production process, various defects will inevitably appear in the welding process, and may further lead to product quality problems
In actual production, common defects include lead lift, no lead, lead offset, etc.

Method used

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  • Product quality testing method and device
  • Product quality testing method and device

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Embodiment Construction

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0029] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the conte...

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Abstract

The embodiment of the invention provides a product quality detection method and device. The method comprises the steps that detection equipment generates a three-dimensional product image which corresponds to a to-be-detected product and comprises a welding spot area according to images shot by shooting equipment under different light sources and different visual angles; a measurement model for measuring the spot welding area in the three-dimensional product image is established according to an optical triangulation method; And preliminary detection is performed on the spot welding area in thethree-dimensional product image by using the measurement model. And for the to-be-detected product passing the preliminary detection, the to-be-detected product is detected again by using the first classification model. And only the to-be-detected product passing the preliminary detection is detected again, so that the calculation pressure of the detection equipment can be reduced. And then determining which defect the to-be-detected product has by using the confirmation processing logic corresponding to the at least one defect type obtained after re-detection. In the re-detection process, the used confirmation processing logic is targeted, and any person does not intervene in the whole processing process.

Description

technical field [0001] The invention relates to the technical field of automatic detection, in particular to a product quality detection method and device. Background technique [0002] Soldering is a common and important process in the manufacture of electronic devices. Due to the influence of many factors such as production environment, production equipment and production process, various defects will inevitably appear in the welding process, and may further lead to product quality problems. In actual production, common defects include lead lift, no lead, lead offset and so on. [0003] Along with the strict requirements on the processing technology in the production line, higher requirements are put forward for the detection capability of electronic device defects. Therefore, how to accurately identify whether there are defects in electronic devices is particularly important. Contents of the invention [0004] In view of this, embodiments of the present invention pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06T7/00G06K9/00G06K9/62G01N21/88G01N21/95
Inventor 于洋洋班永杰白璐丁越时振喆闫秀英董小龙李恩龙
Owner GEER TECH CO LTD
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