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LED encapsulation structure and preparation method thereof, and LED lamp

A technology of LED packaging and LED chips, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of high cost and cumbersome steps, and achieve the effects of reducing production costs, avoiding light decay, and avoiding craftsmanship

Active Publication Date: 2020-07-31
佛山市顺德区蚬华多媒体制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide an LED packaging structure and its preparation method, as well as an LED lamp for the problems of cumbersome steps and high cost of the traditional anti-halogenation method.

Method used

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  • LED encapsulation structure and preparation method thereof, and LED lamp
  • LED encapsulation structure and preparation method thereof, and LED lamp
  • LED encapsulation structure and preparation method thereof, and LED lamp

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Embodiment Construction

[0033] In order to make the purpose, technical solution and advantages of the present invention clearer, the LED package structure and its preparation method, and the LED lamp of the present invention will be further described in detail through the following examples and with reference to the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0034] see Figure 1-3 , the embodiment of the present invention provides an LED packaging structure, including a cup-shaped bracket 10, an LED chip 20, an insulating powder layer, a metal layer 50, and an encapsulant 30. The cup-shaped bracket 10 includes a substrate 12 and a side wall 14. The side wall 14 and the substrate 12 jointly form the cavity of the cup-shaped bracket 10, the metal layer 50, the spacer powder layer and the LED chip 20 are arranged in the cavity, and the metal The layer 50 is disposed on ...

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Abstract

The invention discloses an LED packaging structure. The LED packaging structure comprises a cup-shaped support, an LED chip, an isolation powder layer, a metal layer and a packaging adhesive, whereinthe cup-shaped support comprises a substrate and side walls, the side walls and the substrate jointly form a cavity of the cup-shaped support, the metal layer, the isolation powder layer and the LED chip are arranged in the cavity, the metal layer is arranged on the surface of the substrate, the LED chip is fixed to the metal layer, the isolation powder layer is at least arranged in a region, where the LED chip is not arranged, of the metal layer, the isolation powder layer comprises isolation powder, the cavity is filled with the packaging adhesive, and the packaging adhesive covers the LED chip and the isolation powder layer. The invention furthermore discloses a preparation method of the LED packaging structure and an LED lamp.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to an LED packaging structure, a preparation method thereof, and an LED lamp. Background technique [0002] Due to its environmental protection, long life, and low energy consumption, LED light sources have attracted much attention, and have been widely used in commercial lighting and home lighting. Common packaging methods for LED light sources include Surface Mounting Device (SMD) and multi-LED chip integrated packaging (Chip on Board, COB). Due to the reflective requirements on the package substrate, the surface of the package substrate generally has a silver metal layer. However, during the use of LED light sources, the accessories of lamps and the environment may contain sulfur elements, and halogen elements such as sulfur, chlorine, and bromine enter the interior of the light source, and can chemically react with silver metal to form dark substances, resulting in a part of the li...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/56H01L33/00
Inventor 邓自然王书方朱俊忠黄宇传苏澄湖
Owner 佛山市顺德区蚬华多媒体制品有限公司