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Plug-and-play IGBT power module bonding wire fault monitoring system

A power module, plug-and-play technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve the problem of failing to realize online monitoring of IGBT power modules, and achieve the effect of a wide range of applications

Inactive Publication Date: 2019-08-02
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The health monitoring methods of the above-mentioned IGBT modules are all applied in the offline state, and the online monitoring of the IGBT power module cannot be realized.

Method used

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  • Plug-and-play IGBT power module bonding wire fault monitoring system
  • Plug-and-play IGBT power module bonding wire fault monitoring system
  • Plug-and-play IGBT power module bonding wire fault monitoring system

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specific Embodiment approach

[0032] The present invention will be further described below in conjunction with drawings and embodiments.

[0033] refer to figure 1 , the plug-and-play IGBT power module bonding wire fault monitoring system of the present invention includes a control module 10 , a monitoring module 20 , a modulation modification module 30 and a plug-and-play interface 40 . The plug-and-play interface 40 is used for connection among the control module 10 , the monitoring module 20 and the modulation modification module 30 .

[0034] see figure 2 and image 3 , the control module 10 includes a host computer 11, a voltage acquisition card 12, a temperature acquisition card 13 and a thermocouple 14, the voltage acquisition card 12 and the temperature acquisition card 13 are connected to the host computer 11 through a USB interface, and one end of the thermocouple 14 is connected to the On the channel of the temperature acquisition card 13. The monitoring module 20 includes a monitoring cont...

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Abstract

The invention discloses a plug-and-play IGBT power module bonding wire fault monitoring system comprising a control module, a monitoring module, a modulation modification module and a plug-and-play interface. The monitoring system can be used to realize the off-line and on-line monitoring of the IGBT power module. The control module is used for sending a monitoring instruction to the monitoring module and receiving the actually measured data of the monitoring module. The monitoring module is used for measuring fault characteristic parameters required by determining the health state of the bonding wire of the IGBT power module. The modulation modification module is used for modifying and controlling the PWM waveform of the on-off of the IGBT to be detected in the IGBT power module during the on-line monitoring so as to inject on-line monitoring current. The control module, the monitoring module and the modulation modification module are connected through a plug-and-play interface. The monitoring system can be used for monitoring the online and offline health states of the bonding wires of various IGBT power modules.

Description

technical field [0001] The invention relates to the field of reliability monitoring of high-power devices, in particular to a plug-and-play type IGBT power module bonding wire fault monitoring system. Background technique [0002] With the rise of emerging industries such as wind power generation, smart grid and electric vehicles, the reliability of power modules has attracted more and more attention from the industry. High-power insulated gate bipolar transistor (insulated gate bipolar transistor, IGBT) is the core device of power electronic devices, its failure may lead to the interruption of system operation, and even cause serious safety accidents and economic losses. Therefore, it is imperative to monitor the reliability of IGBT power modules. [0003] Chinese invention patent application "IGBT Health Status Monitoring Method Based on Collector Leakage Current" (publication number CN105158670A) invented a method for IGBT health status monitoring based on collector leak...

Claims

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Application Information

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IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 马铭遥王也孙志宇詹铭玥杨淑英张兴
Owner HEFEI UNIV OF TECH
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