Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Displacement and acoustic emission integrated sensing device

A technology of acoustic emission sensors and sensing devices, which is applied in measuring devices, uses acoustic wave emission technology for material analysis, and uses sound waves/ultrasonic waves/infrasonic waves to analyze solids, etc., which can solve the problem of poor bearing capacity and performance measurement accuracy, and structural damage state monitoring To improve the detection accuracy and detection efficiency

Active Publication Date: 2021-10-19
BEIJING RES INST OF MECHANICAL & ELECTRICAL TECH
View PDF27 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a displacement and acoustic emission integrated sensing device, which can solve the technical problems of poor bearing capacity and performance measurement accuracy of the structure measured in the high-temperature mechanical-thermal test and poor structural damage state monitoring and diagnosis capabilities in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Displacement and acoustic emission integrated sensing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as any limitation of the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0019] It should be noted that the terminology used here is only for describing specific implementations, and is not intended t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
lengthaaaaaaaaaa
Login to View More

Abstract

The invention provides a displacement and acoustic emission integrated sensing device, the displacement and acoustic emission integrated sensing device includes a waveguide rod, a space positioning module, an acoustic emission sensor and a displacement sensor, and one end of the waveguide rod is connected to the measured object Contact, one end of the spatial positioning module is connected to the other end of the waveguide rod, the spatial positioning module has a housing cavity, the acoustic emission sensor is arranged at the other end of the waveguide rod and is located in the housing cavity, and the spatial positioning module positions the acoustic emission sensor through the housing cavity And clamping, the acoustic emission sensor is used to detect the acoustic emission signal emitted by the measured object transmitted by the waveguide rod, the displacement sensor is connected to the other end of the spatial positioning module, and the displacement sensor is used to detect the displacement generated by the measured object. The technical solution of the present invention is applied to solve the technical problems of poor bearing capacity and performance measurement accuracy of the structure measured in the high-temperature mechanical-thermal test and poor structural damage state monitoring and diagnosis capabilities in the prior art.

Description

technical field [0001] The invention relates to the technical field of spacecraft structure damage monitoring, in particular to a displacement and acoustic emission integrated sensing device. Background technique [0002] Adjacent space refers to the vast airspace with an altitude between 20km and 100km, which is between the traditional sky and the sky. With the rapid development of military theory and military requirements, the defense and strike capabilities in the near-space domain have received widespread attention, and are gradually becoming one of the key development areas of various military powers. As the core weapon system of this airspace operation, near-space vehicles are the main research objects in the field of aerospace integration in the world today. They have the capabilities of rapid response, strong penetration, strong destruction, high maneuverability, and precision strikes. Chemical warfare has had a revolutionary impact. Near-space vehicles are subject...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N29/04G01N29/14G01B17/00
CPCG01B17/00G01N29/04G01N29/14G01N2291/0234G01N2291/2675
Inventor 高勇肖登红李乃田孟繁超叶全红张苏周小红仝宗凯魏域鹏
Owner BEIJING RES INST OF MECHANICAL & ELECTRICAL TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products