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Rubber head moisturizing device and glue coating equipment

A technology of moisturizing device and glue head, applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve problems such as affecting the performance of photoresist

Active Publication Date: 2021-09-24
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the purpose of this application is to provide a rubber head moisturizing device and glue coating equipment to solve the problem that the glue dropping head moisturizing device in the prior art makes the moisturizing liquid enter the inside of the glue dropping head to dilute the photoresist and thus affect the photoresist. performance problem

Method used

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  • Rubber head moisturizing device and glue coating equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The rubber head moisturizing device provided in this embodiment includes: a moisturizing box, a sealing baffle, a liquid supply pipeline, a liquid supply source (not shown in the figure) and a control system (not shown in the figure). The connection relationship and actions of the above-mentioned components of the rubber head moisturizing device will be described in detail below.

[0034]In an embodiment of the present invention, a cavity capable of being sealed can be formed inside the humidifying box, and an opening is provided on its upper end surface, so that the cavity communicates with the external environment, and the dispensing head can enter the moisturizing chamber through the opening In the cavity of the box; the interior of the humidity box is provided with a sealing baffle, and the sealing baffle can adopt a flange-shaped integral structure, including a fixing part and a sealing part. In this embodiment, the humidifying box may include a humidifying box mai...

Embodiment 2

[0040] Further, on the basis of Embodiment 1, please refer to figure 1 The rubber head moisturizing device provided in this embodiment includes: a moisturizing box 1, an overflow member 3, a sealing baffle 2, a liquid supply pipeline 4, a waste discharge pipeline 5, a waste liquid collection device (not shown in the figure), Liquid supply source (not shown in the figure) and control system (not shown in the figure). The connection relationship and actions of the above-mentioned components of the rubber head moisturizing device will be described in detail below.

[0041] In an embodiment, the humidity box 1 may include a humidity box body 11 and a humidity box cover 12 , wherein the fixing portion 21 of the sealing baffle 2 is interposed between the humidity box body 11 and the humidity box cover 12 . In addition, the lower end surface of the humidifying box cover 12 is fixedly equipped with a sealing ring 121. For example, the sealing ring 121 can be pasted and installed with...

Embodiment 3

[0051] On the basis of Embodiment 2, the rubber head moisturizing device provided in this embodiment includes: a moisturizing box, an overflow channel, a sealing baffle, a liquid supply pipeline, a waste discharge pipeline, and a waste liquid collection device (not shown in the figure). ), liquid supply source (not shown in the figure) and control system (not shown in the figure). The connection relationship and actions of the above-mentioned components of the rubber head moisturizing device will be described in detail below.

[0052] In this embodiment, the overflow channel is directly arranged on the side wall of the humidifying box, and the design of the overflow member is cancelled, wherein, the height of the overflow channel is the same as that of the upper end of the overflow member in Embodiment 2, and the overflow channel is still the same as The first end of the waste discharge pipeline is connected, and when the liquid level of the moisturizing liquid inside the mois...

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Abstract

The application provides a rubber head moisturizing device and glue application equipment, including: a moisturizing box, a cavity that can be sealed is formed inside, and an opening that can be closed is formed, and the glue dispensing head can enter the cavity through the opening The sealing baffle includes a fixed portion and a sealing portion extending downward from the fixed portion, the sealing baffle is fixedly installed in the inside of the humidifying box through the fixing portion, and the sealing portion extends to the inside of the humidifying box to form a first connected to each other The moisturizing channel and the second moisturizing channel, the second moisturizing channel is formed by the inner wall of the moisturizing box and the outer wall of the sealing part, the lower end of the sealing part can be immersed in the moisturizing liquid supplied from the liquid supply pipeline, so that the inside of the moisturizing box is sealed The cavity; the liquid supply pipeline communicates with the inside of the humidifying box. In this application, the liquid surface of the moisturizing liquid seals the first moisturizing channel so that the first moisturizing channel forms a sealed cavity that is isolated from air, so that when the dispensing head of the gluing equipment is in the waiting stage of work, it is moisturized under the action of the steam of the moisturizing liquid.

Description

technical field [0001] The present application relates to the field of semiconductor photolithography technology, in particular to a rubber head moisturizing device and glue coating equipment. Background technique [0002] The photolithography process is one of the essential steps in the semiconductor production process. The photolithography process mainly includes glue coating, exposure and development. Among them, coating a uniform photoresist layer on the surface of a semiconductor wafer has very high requirements on the spit volume accuracy and viscosity of the photoresist. When the dispensing head of the automatic dispensing equipment is in the waiting stage of work, because the solvent in the photoresist is volatile, it will cause the dispensing head and the inner wall of the dispensing head to condense the photoresist, resulting in the accuracy of the amount of glue spit and the accuracy of the photoresist. Viscosity changes, affecting the thickness and thickness uni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/6715
Inventor 艾博董晴晴周立庆吕磊贾月明
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC