Baking suit for molecular beam epitaxy equipment and method of use thereof
A molecular beam epitaxy and equipment technology, which is applied in the field of baking clothing of molecular beam epitaxy equipment, can solve problems such as poor thermal insulation performance of baking clothing, and achieve the effects of reducing the difficulty of preparation and improving the sealing performance.
Active Publication Date: 2021-07-02
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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Problems solved by technology
[0004] The embodiment of the present invention provides a baking suit for molecular beam epitaxy equipment and its use method, to solve the problem of poor thermal insulation performance of the baking suit in the prior art
Method used
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[0034] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0035] On the one hand, an embodiment of the present invention provides a baking suit 2 for molecular beam epitaxy equipment 1 .
[0036] Molecular beam epitaxy equipment is composed of vacuum system, beam source system, heating system, transmission system and other parts. Its working principle is that the vacuum system provides an ultra-high vacuum environment to ensure the normal progress of the molecular beam epitaxy process. Th...
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The invention discloses a baking suit for molecular beam epitaxy equipment and a method for using the same. The molecular beam epitaxy equipment includes a body part and at least one protrusion part, and the protrusion part is connected to the body part and protrudes from the outer surface of the body part. The baking clothing includes a main structure suitable for wrapping the main body, the main structure includes at least one hole; and split structures corresponding to the holes one by one, the split structures are detachably connected with the main structure, and each split structure is suitable for In order to cover the corresponding holes, each split structure is provided with a through hole, the through holes correspond to the protrusions one by one and have the same size, and are sleeved on the corresponding protrusions. In the present invention, the separate structure of the baking suit is separately designed according to the convex part of the molecular beam epitaxy equipment, so that the through hole of the separate structure is attached to the convex part, which not only ensures the connection between the through hole and The contact tightness between the raised parts can also reduce the difficulty of preparing the baking clothes, improve the preparation efficiency of the baking clothes and reduce the manufacturing cost.
Description
technical field [0001] The invention relates to the technical field of molecular beam epitaxy equipment, in particular to a baking suit for molecular beam epitaxy equipment and a using method thereof. Background technique [0002] Molecular beam epitaxy equipment is composed of vacuum system, beam source system, heating system, transmission system and other parts. Its working principle is that the vacuum system provides an ultra-high vacuum environment to ensure the normal progress of the molecular beam epitaxy process. The beam source system is used to provide the beam current required for material epitaxy. The heating system is used to process the substrate and maintain the substrate during the epitaxy process. The bottom temperature is low, and the transmission system is used to connect the various systems. Among them, the beam source system relies on heating high-purity materials to evaporate the required beams to meet the requirements of epitaxy. The high-purity materi...
Claims
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IPC IPC(8): C23C16/54
CPCC23C16/54
Inventor 王丛高达
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP