Packaging process of contact identity card and contact identity card

Abstract

The invention discloses a packaging process of a contact identity card and a contact identity card. The packaging process of the contact identity card comprises the following steps of: providing a conductive substrate, and separately preparing photosensitive films on the front and back surfaces of the conductive substrate; exposing and developing the photosensitive films to form a line pattern structure; forming a resist layer in the region of the line pattern structure; removing the photosensitive films; etching a region on the conductive substrate that does not have the resist layer, forminga plurality of bearing surfaces and a plurality of front electrodes on the front surface of the conductive substrate, and forming a back electrode on the back surface of the conductive substrate to obtain a packaging substrate; implanting a chip into the packaging substrate and performing a plastic packaging process to obtain a chip packaging structure; cutting the chip packaging structure to obtain the contact identity card. The manufacturing process uses the conductive substrate as a base material, reduces the production cost and the product thickness, avoids steps of drilling, electroplating copper, solder resist printing and the like compared with a conventional process, and is simpler.

Description

technical field [0001] The invention relates to the field of packaging of contact-type identification cards, in particular to a packaging process for a contact-type identification card and a contact-type identification card produced by the packaging process. Background technique [0002] With the development of wireless technology, contact identification cards (contact SIM cards) such as mobile phone communication cards, bank cards, and social security cards are widely used. With the vast market of the Internet of Things, the market demand for SIM cards has further increased. In the prior art, during the packaging process of the SIM card, the insulating material covered with copper on both sides is generally used as the base material. During the packaging process, a series of cumbersome processes such as drilling holes on the base material and copper plating are required. The packaging process is complicated, the production efficiency is low, the cost is high, and the produ...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies in the prior art, one of the purposes of the present invention is to disclose a packaging process for a contact-type identificatio

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