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Light emitting manufacturing method

A light-emitting element, light-sensitive technology, applied in electrical components, semiconductor/solid-state device manufacturing, electric-solid-state devices, etc., can solve the problems of critical size not less than 100 microns, difficult pixel density, etc.

Inactive Publication Date: 2020-02-25
INNOVATION & TRANSFORMATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of the existing technology, the pixel definition is achieved by coating the luminescent material on the substrate via a mask, and the critical dimension on the mask usually cannot be smaller than 100 microns
Therefore, having a pixel density above 800ppi becomes a difficult task for OLED manufacturers

Method used

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  • Light emitting manufacturing method
  • Light emitting manufacturing method
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Examples

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Embodiment Construction

[0009] The following disclosure provides many different embodiments or examples for implementing different features of this application. Specific examples of components and configurations are described below to simplify the disclosure of this application. Of course, these are only examples and are not intended to limit the application. For example, the following description of forming a first feature on or above a second feature may include an embodiment in which the first and second features are formed in direct contact, and may also include an embodiment in which other features are formed between the first and second features Therefore, the first and second features are not in direct contact. In addition, the present application may repeat component symbols and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not govern the relationship between the different embodiments and / or the discussed architectures.

[0010] I...

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Abstract

The present disclosure provides a method for manufacturing a light emitting device. The method includes providing a substrate, and forming a photosensitive layer over the substrate. The method also includes patterning the photosensitive layer to form a first recess and a first bump. The method also includes disposing a first organic layer in the first recess. The method also includes patterning the photosensitive layer to form a second recess and a second bump. The method also includes disposing a second organic layer in the second recess.

Description

Technical field [0001] This application claims the priority right of U.S. Provisional Patent Application No. 62 / 719,039 filed on August 16, 2018 and U.S. Patent Application No. 16 / 232,880 filed on December 26, 2018. The U.S. Provisional Patent All disclosures of the application and the US patent application are incorporated into this case for reference. [0002] The present disclosure relates to a manufacturing method of a light-emitting element. Background technique [0003] Organic light emitting displays (OLED) have been widely used in the most high-end electronic devices. However, due to the limitation of the prior art, the pixel definition is realized by coating a luminescent material on the substrate through a mask, and the critical dimension on the mask is usually not less than 100 microns. Therefore, it is a difficult task for OLED manufacturers to have a pixel density above 800ppi. Summary of the invention [0004] In this disclosure, the light-emitting unit is formed by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H10K99/00
CPCH10K59/122H10K59/1201H10K59/131H10K59/35H10K50/171H10K50/15H10K50/16G06F3/013G09G3/2074G09G2340/0407G09G2354/00H04N23/00H10K50/11H10K50/844H10K71/00H10K71/233
Inventor 黄丰裕陈慧修陈政欣
Owner INNOVATION & TRANSFORMATION