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Method for enhancing reliability of parallel seam welding packaging salt mists

A parallel seam welding and reliability technology, applied in liquid chemical plating, coatings, electrical components, etc., can solve problems such as corrosion failure, increase production costs, improve salt spray corrosion resistance, and high reliability requirements. Effect

Inactive Publication Date: 2020-02-28
58TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to provide a method for enhancing the salt spray reliability of parallel seam welding packaging, so as to solve the problem that the packaging products using parallel seam welding technology are prone to rust and failure in the smoke test

Method used

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  • Method for enhancing reliability of parallel seam welding packaging salt mists
  • Method for enhancing reliability of parallel seam welding packaging salt mists
  • Method for enhancing reliability of parallel seam welding packaging salt mists

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Embodiment 1

[0032] The present invention provides a method for enhancing the reliability of parallel seam welding package salt spray, the process of which is as follows figure 1 shown, including the following steps:

[0033] Step S11, pre-cleaning the ceramic packaging device that has completed parallel seam welding;

[0034] Step S12, coating the part of the ceramic packaging device that does not need to be electroplated with photoresist and drying;

[0035] Step S13, after the ceramic packaging device is dried, it is placed in an electroless plating pool for metal re-plating to form an anti-corrosion layer;

[0036] Step S14 , removing the photoresist on the ceramic packaging device and washing and drying.

[0037] First of all, parallel seam soldered ceramic package devices such as figure 2 As shown, put it into deionized water for ultrasonic pre-cleaning, the time is 10 minutes;

[0038] Next, coat the part of the ceramic package device that does not need to be electroplated (inc...

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Abstract

The invention discloses a method for enhancing reliability of parallel seam welding packaging salt mists, and relates to the technical field of integrated circuit electronic packaging. The method comprises the steps that a ceramic packaging device completely subjected to parallel seam welding is pre-cleaned; the part, with no need of re-plating, in the ceramic packaging device is coated with photoresist and dried; then the dried ceramic packaging device is put into a plating pool for metal re-plating to form an anti-corrosion layer; and the photoresist on the ceramic packaging device is removed, and the ceramic packaging device is cleaned and dried. According to the method, the plating damage caused by the sealing cover process to welding edges is repaired by performing re-plating on the existing process, no new equipment needs to be introduced, the production cost is not increased, and the circuit performance is not affected due to the fact that no pin needs to be electrified during re-plating. The anti-salt-mist corrosion performance of a parallel seam welding alloy cover plate can be improved, the application requirements of more severe salt mist environment application of integrated circuit products can be met at the same time, and the high reliability requirements of the parallel seam welding sealing technology packaging device are met.

Description

technical field [0001] The invention relates to the technical field of integrated circuit electronic packaging, in particular to a method for enhancing the salt spray reliability of parallel seam welding packaging. Background technique [0002] Parallel seam welding is an important cover sealing technology for highly reliable integrated circuit hermetic packaging. This technology uses the principle of resistance welding to melt the coating on the opposite side of the cover through the heat generated by the roller electrodes; Rolling up, the solder joints are formed one by one to form a fish-scale weld seam, which realizes the welding between the cover plate and the sealing ring of the ceramic or metal shell. This kind of welding belongs to local welding. When the welding current passes through the contact between the electrode and the cover plate, and the contact between the cover plate and the sealing ring, enough heat is generated to melt the plating at the two contacts. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/32C23C18/42H01L23/10
CPCC23C18/1605C23C18/32C23C18/42H01L23/10
Inventor 颜炎洪李杨陈陶徐衡王成迁李守委朱召贤
Owner 58TH RES INST OF CETC
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