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Antenna packaging module and electronic device

A technology for antenna and molding, which is applied in the directions of antenna, antenna support/mounting device, antenna coupling, etc., and can solve the problems such as application limitations of millimeter wave packaged antenna modules

Active Publication Date: 2020-03-06
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the application of millimeter-wave packaged antenna modules in circular polarization scenarios is still limited

Method used

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  • Antenna packaging module and electronic device
  • Antenna packaging module and electronic device
  • Antenna packaging module and electronic device

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Embodiment Construction

[0029] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0030] It can be understood that the terms "first", "second" and the like used in this application may be used to describe various elements herein, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element, and should not be interpreted as indicating or implying relative importance or implying the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "...

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Abstract

The present application relates to an antenna packaging module and an electronic device. The antenna packaging module includes: an antenna substrate having a first side and a second side disposed opposite to each other; a first laminated circuit disposed on the first side of the antenna substrate and having a side away from the antenna substrate used for holding a radiofrequency chip; a radiationstructure disposed on the second side of the antenna substrate; and a feed network including a 90-degree directional coupling structure disposed in the first laminated circuit and a transmission linepassing through the antenna substrate and the first laminated circuit. By introducing the 90-degree directional coupling structure and connecting the radiofrequency chip and the radiation structure through the transmission line, it is possible to feed the radiation structure so that the radiation structure realizes circularly polarized radiation, and improve the degree of isolation between feed ports and reduce mutual coupling between antenna units.

Description

technical field [0001] The present application relates to the technical field of antennas, in particular to an antenna packaging module and electronic equipment. Background technique [0002] With the development of wireless communication technology, 5G network technology is also born. As the fifth-generation mobile communication network, 5G network has a peak theoretical transmission speed of tens of Gb per second, which is hundreds of times faster than that of 4G network. Therefore, the millimeter wave frequency band with sufficient spectrum resources has become one of the working frequency bands of the 5G communication system. [0003] The millimeter-wave packaged antenna module is the mainstream packaging solution in the future 5G millimeter-wave electronic equipment. It can adopt a multi-layer PCB high-density interconnection process and set a radiation structure on one side of the module. However, the application of millimeter-wave packaged antenna modules in circula...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q21/08H01Q21/00H01Q1/52H01Q1/50H01Q1/38H01Q1/24H01Q1/22H01P5/18
CPCH01P5/184H01Q1/22H01Q1/2266H01Q1/243H01Q1/38H01Q1/50H01Q1/523H01Q21/00H01Q21/0006H01Q21/08
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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