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Camera device and manufacturing method thereof

A technology of a camera device and a manufacturing method, which is applied in the directions of image communication, TV, color TV components, etc., can solve the problems of increasing production cost, assembly man-hours, and complex assembly process.

Active Publication Date: 2020-04-24
LITE ON ELECTRONICS (GUANGZHOU) LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such an alignment method makes the assembly process complicated, and increases production costs and assembly man-hours

Method used

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  • Camera device and manufacturing method thereof
  • Camera device and manufacturing method thereof
  • Camera device and manufacturing method thereof

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Embodiment Construction

[0023] Please refer to Figure 1A~Figure 1B , Figure 1A Shows a schematic diagram of a camera device 100 according to an embodiment of the present invention, and Figure 1B Illustrate Figure 1A A cross-sectional view of the imaging device 100 along the direction 1B-1B'. The camera device 100 includes a first cover 110, a second cover 120, a circuit board 130, an image sensor 140, an adhesive 150, a lens 160, an adhesive 170 and a structure ring 180.

[0024] The first cover 110 is docked with the second cover 120. The second cover 120 has a second groove 120r, the first cover 110 has a second end 112, the second end 112 is located at least a part of the second groove 120r, and the second end 112 and the second groove 120r The side walls are in close contact to enhance the combination of the first cover 110 and the second cover 120. In terms of process, the second end 112 is melted by laser welding to fill at least a part of the second groove 120r, and solidify after cooling to c...

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PUM

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Abstract

The invention provides a camera device and a manufacturing method thereof. The camera device comprises a lens, a first cover, a second cover, a circuit board, an image sensor, a bonding adhesive, a sealing adhesive and a structural ring. The second cover is in butt joint with the first cover. The circuit board is disposed on the second cover. The image sensor is arranged on the circuit board. Thebonding adhesive enables the relative position between the circuit board and the lens to be fixed and to surround the image sensor. The sealing adhesive is disposed between the first cover and the lens. The structural ring is disposed between the first cover and the lens and blocks the adhesive. Thus, in one embodiment, the lens can be assembled without a support frame.

Description

Technical field [0001] The present invention relates to an imaging device and a manufacturing method thereof, and more particularly to an imaging device whose lens is arranged on a circuit board and a manufacturing method thereof. Background technique [0002] In recent years, automotive cameras have used Active Alignment (AA process) to align the optical axis of the lens with the image sensor. At present, most of the assembly of the lens is to first assemble the lens on the support frame, and then perform the alignment process. However, such an alignment method causes a complicated assembly process and increases production costs and assembly man-hours. Summary of the invention [0003] The object of the present invention is to provide an imaging device and a manufacturing method thereof, which can improve the aforementioned existing problems. [0004] In order to achieve the above objective, according to an embodiment of the present invention, an imaging device is provided. The ...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/55H04N23/51H04N23/54
Inventor 周义明何介文李其霆
Owner LITE ON ELECTRONICS (GUANGZHOU) LTD