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Laminate substrate manufacturing apparatus, laminate substrate manufacturing line and laminate substrate manufacturing method

A technology for manufacturing devices and substrates, which is applied in the field of laminated substrate manufacturing devices, and can solve problems such as inability to transport workpieces, inability to laminate workpieces, and quality problems.

Active Publication Date: 2020-07-07
BEAC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even if the mechanical arm 941 of a robot or the like described in Patent Document 3 is introduced into the "laminate substrate manufacturing apparatus", it cannot originally place / hold the above-mentioned workpiece on the robotic arm 941, and thus cannot control the workpiece. to transport
In addition, even if such a workpiece can be placed on the robot arm 941, it may cause fine single pieces to fall during transportation, or the position of a single piece may be shifted, and it may also cause damage to the workpiece during transportation. Scratches and defective products (in the case of substrates such as film substrates and flexible substrates)
[0026] Therefore, for the robotic arm 941 such as the robot described in Patent Document 3, it is impossible to transport (feed) the workpiece involved in the "laminated substrate manufacturing apparatus", and it may also cause quality problems.
[0027] Furthermore, the joining mechanism 903 described in Patent Document 3 is configured to join workpieces (the first substrate and the second substrate) whose upper end surfaces are substantially flat, but when the upper end surfaces of the workpieces are concave-convex (height different pieces are placed on the substrate, etc.), the workpiece cannot be laminated well

Method used

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  • Laminate substrate manufacturing apparatus, laminate substrate manufacturing line and laminate substrate manufacturing method
  • Laminate substrate manufacturing apparatus, laminate substrate manufacturing line and laminate substrate manufacturing method
  • Laminate substrate manufacturing apparatus, laminate substrate manufacturing line and laminate substrate manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0070] 1. Workpiece W and pallet P

[0071] Before describing the laminated substrate manufacturing apparatus 1 , the workpiece W and the pallet P to be processed by the laminated substrate manufacturing apparatus 1 will be described.

[0072] figure 1 It is a figure shown for explaining the workpiece|work W and pallet P. figure 1 (a) is a plan view after placing the workpiece W and the pallet P upright on a horizontal plane, figure 1 (b) is figure 1 (a) A-a cross-sectional view. The symbol SL of the two-dot dash line represents a seal line which will be described later, and the symbol WSF represents the upper end surface of the workpiece W. As shown in FIG.

[0073] (1) Workpiece W

[0074] The "work W" in this specification refers to "the totality of the substrate BD and the plurality of single-chip PCs" in a state where the plurality of single-chip PCs are pre-pressed on the substrate BD (see figure 1 ).

[0075] A plurality of single-chip PCs are placed on the ...

Embodiment approach 2

[0216] Below, refer to Figure 9 The configuration of the laminated substrate production line 10 according to the second embodiment will be described. Figure 9 It is a schematic diagram shown for explaining the laminated board production line 10 concerning Embodiment 2.

[0217] The laminated substrate production line 10 according to Embodiment 2 manufactures a laminated substrate by pre-pressing a plurality of individual PCs on a substrate BD and further performing main pressure bonding.

[0218] The laminated substrate production line 10 involved in Embodiment 2 includes: a pre-crimping device 7 for pre-crimping a plurality of single PCs on the substrate BD; a tray distribution device 8 for removing the tray P from the pre-crimping device Distributed to any one of a plurality of pallet conveying devices 9; a plurality of pallet conveying devices 9, one end of which is respectively connected with the pallet distributing device 8, and conveys the pallet P distributed from th...

example 1

[0228] Since as long as multiple single sheets can be laminated, a single single sheet can be laminated, and the same effect is achieved, so this laminated substrate manufacturing device is also equivalent to the laminated substrate manufacturing device of the present invention. 1.

[0229] (2) In addition, if Figure 10 As shown in (a), a sealing member (third sealing member 234 ) made of resin or the like may be attached to the upper end surface of the tray mounting table 230 .

[0230]When the tray P is placed on the upper end surface of the tray placement table 230, the third sealing member 234 can relax the impact. In addition, since the tray P is placed in a manner adapted to the tray placement table 230, it is possible to place the tray P The positioning is carried out more accurately. In addition, a sealing member (third sealing member 234 ) made of resin or the like may be attached to the lower end surface of the tray P. As shown in FIG.

[0231] And, it is also po...

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PUM

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Abstract

The invention provides a laminated substrate manufacturing apparatus, which can more efficiently feed and remove workpieces compared with the prior art and can laminate the workpieces while suppressing mass deviation. This laminated substrate manufacturing apparatus is provided with a tray conveyance unit (100) for intermittently conveying a tray (P) on which a workpiece (W) is placed, and the tray conveyance unit (100) is disposed in a state in which a lamination region (R1) in which a heating head (320) is disposed overlaps with a region (R2) in which the tray conveyance unit (100) is disposed. The lower edge portion 312 of the lamination unit 300 is lowered toward the positioned tray P, and a temporary cavity CH is formed by abutting the lower edge portion 312 against the tray P, the workpiece W is laminated by pressing the heating surface 326 toward the workpiece W in a state where the workpiece W is placed on the tray P and the inside of the cavity CH has been vented.

Description

technical field [0001] The present invention relates to a laminated substrate manufacturing device, a laminated substrate production line, and a laminated substrate manufacturing method. Background technique [0002] Conventionally, a laminated component formed by bonding a plurality of individual pieces (bonding member) to a substrate (member to be bonded) with an adhesive has been widely known. [0003] This laminated part can be processed by "work" after a plurality of individual pieces are pre-pressed on the substrate (including the case where the substrate is another individual piece as in Patent Document 1). It is obtained by applying pressure (pressurization) in the stacking direction while heating. [0004] In this specification, heating and pressing the workpiece as described above is called "lamination (Laminete) (main crimping)", and the laminated part obtained by this method is called "laminated substrate", An apparatus that obtains a laminated substrate by thi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/00B32B37/06B32B37/10
CPCB32B37/0046B32B37/06B32B37/10Y02E10/50B32B38/1833B32B41/00
Inventor 新垣绫介河东和彦
Owner BEAC CO LTD