Needle planting device and method combining vibration with vacuum
A technology of needle planting and vacuum, applied in the field of needle planting, can solve problems such as low efficiency, inability to respond, and long time consumption, and achieve the effect of high needle planting efficiency
Pending Publication Date: 2020-07-17
SHANGHAI TECHSENSE CO LTD
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Problems solved by technology
[0003] The existing needle implantation technology mainly uses mechanical needle insertion, that is, a high-speed movement mechanism with a gripper at the end, and the needles are planted on the substrate in sequence, and 10 needles can be implanted per second at the fastest, which is low in efficiency and takes a long time. And cannot correspond to needles smaller than a certain diameter or length
Method used
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Embodiment Construction
[0034] Such as figure 1 Shown is a needle implanting device using vibration combined with vacuum. The purpose of this device is to implant needles into a circuit board, which can be vibrated.
[0035] The device of the present invention includes a base 1100 , a gland 1200 , a pressing mechanism 1300 , a vibrating table 1400 and a vacuuming device 1500 .
[0036] Such as figure 2 as well as image 3 As shown, the base 1100 is a rectangular box, which is fixed on the vibrating table 1400 and has a vacuum chamber inside.
[0037] The top of the base 1100 has a needle planting board placement platform 1110 , the bottom has a fixing plate 1120 fixed to the vibrating table 1400 , and the rear side has a vacuum joint 1130 .
[0038] Such as image 3 As shown, the needle planting board 20 is a circuit board with a needle planting area 21 on it. There are multiple needle planting holes in the needle planting area 21. The needle planting holes are stepped holes with a wide upper se...
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The invention discloses a needle planting device combining vibration with vacuum. The device comprises a base fixed on a vibration table, a vacuumizing cavity capable of being vacuumized through vacuumizing equipment is formed in the base; wherein a needle planting plate placing platform is arranged at the top of the base; the needle planting plate placing platform is provided with a first throughhole which is in the vertical direction and corresponds to a needle planting area of the needle planting plate; the first through hole is communicated with the vacuumizing cavity; the needle plantingplate placing platform is provided with a positioning piece used for positioning the gland; and the positioning piece is located around the first through hole; the gland is used for pressing the needle planting plate; and a second through hole corresponding to the needle planting area in the vertical direction is formed in the gland; and the pressing mechanism can be pressed down and locked to apply continuous pressing force to the gland. The needle inserting device is high in needle inserting efficiency and suitable for needles with various diameters or lengths.
Description
technical field [0001] The invention relates to the technical field of needle planting, in particular to a needle planting device and method using vibration combined with vacuum. Background technique [0002] With the advancement of packaging technology, the integration of chips has been continuously improved, the number of I / O pins has increased sharply, power consumption has also increased, and the requirements for integrated circuit packaging have become more stringent. Therefore, in the 1990s, ball grid array packaging (BGA packaging) began to be used in production, and as soon as this technology appeared, it became the best choice for high-density, high-performance, multi-pin packaging such as CPUs, motherboards, and north bridge chips. However, due to the characteristics of the ball pins, the BGA package occupies a relatively large area of the substrate. In order to make the packaged substrate smaller and more integrated, the packaging industry has begun to turn to t...
Claims
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IPC IPC(8): H01L21/50H01L21/60H01L21/67
CPCH01L21/50H01L21/67121H01L24/89
Inventor 梁猛戴伟
Owner SHANGHAI TECHSENSE CO LTD