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Nitrogen-containing compounds, electronic components and electronic devices

A technology of nitrogen compounds and electronic components, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of light-emitting device performance degradation, working voltage increase, luminous efficiency reduction, etc., and achieve good thermal stability, high melting point, enhanced The effect of material stability

Active Publication Date: 2021-07-20
SHAANXI LIGHTE OPTOELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, when organic electroluminescent devices are driven at high temperatures, there will be problems such as increased operating voltage, reduced luminous efficiency, and shortened lifespan, resulting in a decline in the performance of organic electroluminescent devices.

Method used

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  • Nitrogen-containing compounds, electronic components and electronic devices
  • Nitrogen-containing compounds, electronic components and electronic devices
  • Nitrogen-containing compounds, electronic components and electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0156] The anode was prepared by the following process: the thickness was The ITO substrate (manufactured by Corning) was cut into a size of 40mm × 40mm × 0.7mm, and it was prepared into an experimental substrate with cathode, anode and insulating layer patterns by using a photolithography process, using ultraviolet ozone and O 2 :N 2 Plasma surface treatment to increase the work function of the anode (experimental substrate), and then clean the experimental substrate; vacuum evaporation HAT-CN on the experimental substrate (anode) to form a thickness of The hole injection layer (HIL); on the hole injection layer (HIL), compound 1 is vacuum evaporated to form a thickness of The hole transport layer (HTL); TCTA is evaporated on the hole transport layer (HTL) to form a thickness of The hole-assisting layer; on the hole-assisting layer, vapor-deposit CBP as the host, while doping 3% Ir(piq) 2 (acac), forming a thickness of TPBi and LiQ prepared above are mixed according ...

Embodiment 2-23

[0161] An organic electroluminescent device was fabricated by the same method as in Example 1, except that the compounds shown in Table 2 were each used in forming the hole transport layer. The device performance is shown in Table 2.

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Abstract

The application provides a nitrogen-containing compound represented by formula I, an electronic component and an electronic device, which belong to the technical field of organic materials. The application can improve the luminous efficiency of the device.

Description

technical field [0001] The present application relates to the technical field of organic materials, in particular to a nitrogen-containing compound, electronic components and electronic devices. Background technique [0002] With the development of electronic technology, electronic components used to realize electroluminescence or photoelectric conversion have attracted more and more attention. [0003] Taking an organic electroluminescent device as an example, it includes an anode, a functional layer and a cathode that are sequentially stacked. The functional layer includes a hole transport layer, an electroluminescence layer and an electron transport layer. When a voltage is applied to the cathode and anode, the two electrodes generate an electric field. Under the action of the electric field, the electrons on the cathode side move to the electroluminescent layer, and the holes on the anode side also move to the light-emitting layer, and the electrons and holes combine in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C07D487/04H01L51/50H01L51/54H01L51/46H01L51/42
CPCC07D487/04H10K85/633H10K85/615H10K85/6576H10K85/6574H10K30/00H10K85/6572H10K50/15H10K50/00Y02E10/549
Inventor 刘文强韩超
Owner SHAANXI LIGHTE OPTOELECTRONICS MATERIAL CO LTD
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