Substrate processing device
A substrate processing device and substrate technology, which can be used in thin material processing, photolithographic exposure device, transportation and packaging, etc., and can solve the problem of pattern area position deviation and other problems
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Deformed example 2
[0161] When the exposure device is operating normally, the drawing or exposure pattern is continuously continued on the sheet substrate P substantially without interruption, so the optical path of the light beam in the exposure device or each optical component, or the installation part of each component is stabilized at a substantially fixed position. There are many cases in the temperature range (for example, within ±0.5°C). However, if the operating exposure apparatus is temporarily stopped, the operating state of members or components that may become heat sources in the exposure apparatus will change significantly, and the distribution of ambient temperature in the exposure apparatus will also greatly change. Therefore, when components or components that may become heat sources are activated during re-operation, the distribution of the ambient temperature also changes again, whereby there is also a possibility that the quality of the pattern transferred on the sheet substrat...
Deformed example 3
[0163] Also, due to Figure 5 The damper (light absorber) Dmp shown absorbs light from the laser light source at the time sequence when the acousto-optic deflectors AOM1 to AOM6 are in the OFF state during the pattern drawing of the sheet substrate P by the exposure device EX. The light beams LBa and LBb of LSa and LSb may therefore become heat sources. Therefore, when the oscillation of the light beams LBa, LBb from the laser light sources LSa, LSb is stopped during a temporary stop, or the light beams LBa, LBb are shielded by the shutter SH, the temperature of the damper Dmp greatly changes (falls). Therefore, it is preferable to provide a temperature sensor for monitoring the temperature change of the damper Dmp, or a temperature adjustment mechanism for maintaining the temperature of the damper Dmp at the same temperature as the state during operation. Furthermore, in order to prevent the heat of the damper Dmp from being transferred to the surrounding optical components ...
Deformed example 4
[0165] When the operation of the exposure apparatus EX is stopped (the conveyance of the sheet substrate P is stopped), the detection operation of the marks MK1 to MK4 on the sheet substrate P by the alignment system AMn is also stopped. The alignment system AMn irradiates the photosensitive layer on the sheet substrate P with alignment illumination light in a non-photosensitive wavelength range. However, when the operation is stopped, the irradiation of the alignment illumination light is stopped, and the The imaging operation of the two-dimensional imaging element (CCD, CMOS, etc.) which detects the enlarged image of the marks MK1-MK4 with an objective lens is also set to the stop state. Such as figure 2As shown, since the alignment system AMn is arranged in a relatively narrow space between the drawing units U1, U3, U5 and the drum DR, the illumination light for alignment passes through the alignment system AMn, and the alignment system AMn itself The temperature tends to...
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