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A kind of encapsulating material, related adhesive film and its preparation method and photovoltaic module

An encapsulation material and encapsulation film technology, which can be applied to films/sheets without carriers, adhesives, film/sheet adhesives, etc. It can solve problems such as increasing difficulty, and achieve the effect of high reliability and reduced value of bond strength.

Active Publication Date: 2022-05-03
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the use of low-melt finger resin raw materials will greatly increase the difficulty of film casting and extrusion, and the production cost will be greatly increased, while the reduction of film fluidity is limited; UV irradiation treatment (patent CN104497899B), electron beam irradiation treatment ( Patent CN104558802B), the adhesive film has a certain degree of pre-crosslinking, which is the most commonly used treatment method for white high-reflectivity adhesive films, but the equipment and process costs of these methods are relatively high, and the pre-crosslinking process will affect the reliability of the adhesive film. cause a certain impact

Method used

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  • A kind of encapsulating material, related adhesive film and its preparation method and photovoltaic module
  • A kind of encapsulating material, related adhesive film and its preparation method and photovoltaic module
  • A kind of encapsulating material, related adhesive film and its preparation method and photovoltaic module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] 93.069% by weight of ethylene-vinyl acetate copolymer with a melt index of 30g / 10min, 5% by weight of ethylene-vinyl acetate copolymer containing 1.0% by weight of carboxylic acid anhydride groups, 0.01% by weight of ethylene glycol, 0.001% by weight of di Methyl benzylamine, 0.5% by weight of tert-butyl peroxyisopropyl carbonate, 0.9% by weight of triallyl isocyanurate, 0.5% by weight of vinyltriethoxysilane, 0.02% by weight of bis (2,2,6,6-Tetramethyl-4-piperidinyl) sebacate is fully mixed and then added to the extruder to melt and extrude, cast through a T-shaped die to form a film, leave it for 7 days, and record it as S-1.

Embodiment 2

[0089] A mixture of 29.355% by weight of ethylene-butene copolymer and ethylene-propylene copolymer with a melt index of 20g / 10min, 30% by weight of ethylene-butene copolymer containing 10.0% by weight of trimethoxysilane coupling groups, 40% by weight of ethylene-butene copolymer containing 1% by weight of hydroxyl groups, 0.5% by weight of dioctyltin dithiolate, 0.1% by weight of 2,5-dimethyl-2,5-(bis-tert-butylperoxy) Hexane, 0.02% by weight of triallyl cyanurate, 0.02% by weight of vinyltrimethoxysilane, 0.005% by weight of bis(1-octyloxy-2,2,6,6-tetramethyl -4-piperidinyl) sebacate was fully mixed and added to an extruder to melt and extrude, cast through a T-shaped die to form a film, and leave it for 10 days, which was recorded as S-2.

Embodiment 3

[0091] 3.355% by weight of ethylene-pentene copolymer with a melt index of 15g / 10min, 95% by weight of ethylene-pentene copolymer containing 3.0% by weight of isocyanate groups, 0.01% by weight of 1,3-propylene glycol, 0.005% by weight of Stannous octoate, 0.01% by weight of 1,1-bis(tert-amylperoxy)cyclohexane, 0.02% by weight of propoxylated trimethylolpropane triacrylate, 0.8% by weight of tert-butyl vinyl triperoxide Base silane, 0.8% by weight of bis-2,2,6,6-tetramethylpiperidinol of sebacic acid are fully mixed and then added to the extruder to melt and extrude, cast through a T-shaped die to form a film, and place it for 5 days , denoted as S-3.

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Abstract

The invention relates to an encapsulation material, which comprises 0-98% by weight of matrix resin, 1-99% by weight of modified resin, 0-60% by weight of active agent, 0.00001-3% by weight of catalyst, and 0.01-3% by weight of organic peroxide 0.02-2% by weight of silane coupling agent, 0-5% by weight of co-crosslinking agent, 0-2% by weight of light stabilizer, and 0-20% by weight of pigment, each based on the total weight of the components used, And the total consumption of all components is 100% by weight; the present invention also relates to the encapsulating adhesive film prepared by using the encapsulating material and the method for preparing the encapsulating adhesive film, and the present invention also relates to a photovoltaic module prepared by the encapsulating adhesive film .

Description

technical field [0001] The invention relates to an encapsulation material, an encapsulation adhesive film prepared therefrom, a preparation method thereof, and a photovoltaic module prepared by the encapsulation adhesive film. Background technique [0002] With the development of the world economy, the shortage of fossil energy and environmental pollution are becoming more and more serious. The development and utilization of new energy has become a major issue in the development of human society. In this context, more and more countries have launched the "Sunshine Project" to develop solar energy resources and seek new impetus for economic development. [0003] In recent years, the photovoltaic industry has developed rapidly. With the industrialization of double-sided cells, double-glass modules have ushered in explosive development due to their excellent barrier properties and weather resistance. However, compared with traditional single-glass components, the preparation ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/06C09J11/08C09J11/06C09J7/30C09J7/10
CPCC09J4/06C09J11/08C09J11/06C09J7/30C09J7/10C09J2423/04
Inventor 王龙魏梦娟唐国栋陈培侯宏兵周光大林建华
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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