Water-borne epoxy resin preparation device
A technology for water-based epoxy resin and preparation device, which is used in transportation and packaging, dissolving, grain processing, etc., and can solve the problems of single grinding and stirring process, large epoxy resin particles, and low product quality.
Active Publication Date: 2020-10-16
安徽天生新材料有限公司
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Problems solved by technology
[0005] For this reason, the embodiment of the present invention provides a water-based epoxy resin preparation device to solve the problem that the grinding and stirring process in the prior art is single, and some epoxy resin particles are relatively large during preparation. After being together, it is very easy to condense into agglomerates, which makes the final product quality lower
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[0041] The implementation mode of the present invention is illustrated by specific specific examples below, and those who are familiar with this technology can easily understand other advantages and effects of the present invention from the contents disclosed in this description. Obviously, the described embodiments are a part of the present invention. , but not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0042] Such as figure 1 As shown, the present invention provides a kind of aqueous epoxy resin preparation device, comprises reactor 9 and is installed in reactor 9 and is used for the stage grinding mechanism 1 of the stage grinding that epoxy resin raw material is circulated;
[0043] The stage grinding mechanism 1 includes a rotating grinding sleeve 8 installed on the inner wall of the reactor ...
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The embodiment of the invention discloses an water-borne epoxy resin preparation device. The water-borne epoxy resin preparation device comprises a reactor and a stage grinding mechanism installed inthe reactor and used for carrying out stage type grinding on epoxy resin raw materials in a circulating mode. According to the device, the operation that the stage type grinding is carried out on theraw materials and the ground raw materials are sent back to a filter separator to be ground again can be realized through the filter separator and a raw material refluxing device, so that the phenomenon of large particles of the raw materials cannot easily occur due to the operation, when the operation is carried out, only the raw materials are injected into a guide pipe, so that the raw materialsenter into the filter separator to be ground in different stages, the fine raw materials firstly enter into a tooth column rotating sleeve to be ground sufficiently, the raw materials can be ground more finely, then the raw materials directly enter into a circulating grinder through the guide pipe, at the moment, the raw materials are mixed with an emulsifier aqueous solution, meanwhile, the circulating grinder can inject the raw materials with larger particles in the solution into the filter separator to be ground again, and the solution does not coagulate into blocks.
Description
technical field [0001] The embodiment of the present invention relates to the technical field of epoxy resin, in particular to a water-based epoxy resin preparation device. Background technique [0002] Water-based epoxy resins can be divided into anionic resins and cationic resins, anionic resins are used for anodic electrodeposition coatings, and cationic resins are used for cathodic electrodeposition coatings. The main feature of water-based epoxy resin is its excellent anti-corrosion performance. In addition to being used for automobile coating, it is also used in fields such as medical equipment, electrical appliances and light industrial products. [0003] There are many ways to prepare water-based epoxy resin, and there are many devices used. One of the most used methods is the mechanical method, that is, the direct emulsification method. The solid ring can be mixed with a ball mill, colloid mill, homogenizer, etc. Oxygen resin is ground into micron-sized epoxy resin...
Claims
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IPC IPC(8): B02C19/00B02C17/10B02C23/16B01F13/10B01F3/08
CPCB02C19/00B02C17/10B02C23/16B02C2023/165B01F23/41B01F33/833B01F2101/30
Inventor 石振候
Owner 安徽天生新材料有限公司