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A kind of waterborne epoxy resin preparation device

A technology of water-based epoxy resin and preparation equipment, which is applied in the directions of transportation and packaging, mixers, dissolution, etc., and can solve the problems of low product quality, large epoxy resin particles, and single grinding and stirring process

Active Publication Date: 2021-09-10
安徽天生新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] For this reason, the embodiment of the present invention provides a water-based epoxy resin preparation device to solve the problem that the grinding and stirring process in the prior art is single, and some epoxy resin particles are relatively large during preparation. After being together, it is very easy to condense into agglomerates, which makes the final product quality lower

Method used

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  • A kind of waterborne epoxy resin preparation device
  • A kind of waterborne epoxy resin preparation device
  • A kind of waterborne epoxy resin preparation device

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Embodiment Construction

[0041] The implementation mode of the present invention is illustrated by specific specific examples below, and those who are familiar with this technology can easily understand other advantages and effects of the present invention from the contents disclosed in this description. Obviously, the described embodiments are a part of the present invention. , but not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0042] Such as figure 1 As shown, the present invention provides a kind of aqueous epoxy resin preparation device, comprises reactor 9 and is installed in reactor 9 and is used for the stage grinding mechanism 1 of the stage grinding that epoxy resin raw material is circulated;

[0043] The stage grinding mechanism 1 includes a rotating grinding sleeve 8 installed on the inner wall of the reactor ...

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Abstract

The embodiment of the present invention discloses a water-based epoxy resin preparation device, including a reactor and a stage grinding mechanism installed in the reactor and used for staged grinding of epoxy resin raw materials. and the raw material reflux device to realize the operation of grinding the raw material in stages and sending the ground raw material back to the filter for re-grinding. This operation can prevent the raw material from easily appearing larger particles. When it is implemented, only use The raw material is injected into the feed pipe, so that the raw material enters the filter and is divided into different stages for grinding. The fine raw material will first enter the gear column sleeve for sufficient grinding, so that the raw material can be ground finer, and then the raw material will pass through the lead material. The tube directly enters the circulation mill, at this time the raw materials will be mixed with the emulsifier aqueous solution, and at the same time, the circulation mill will inject the raw materials with larger particles in the solution into the filter for further grinding, so that the solution will not coagulate into lumps.

Description

technical field [0001] The embodiment of the present invention relates to the technical field of epoxy resin, in particular to a water-based epoxy resin preparation device. Background technique [0002] Water-based epoxy resins can be divided into anionic resins and cationic resins, anionic resins are used for anodic electrodeposition coatings, and cationic resins are used for cathodic electrodeposition coatings. The main feature of water-based epoxy resin is its excellent anti-corrosion performance. In addition to being used for automobile coating, it is also used in fields such as medical equipment, electrical appliances and light industrial products. [0003] There are many ways to prepare water-based epoxy resin, and there are many devices used. One of the most used methods is the mechanical method, that is, the direct emulsification method. The solid ring can be mixed with a ball mill, colloid mill, homogenizer, etc. Oxygen resin is ground into micron-sized epoxy resin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B02C19/00B02C17/10B02C23/16B01F13/10B01F3/08
CPCB02C19/00B02C17/10B02C23/16B02C2023/165B01F23/41B01F33/833B01F2101/30
Inventor 邢军石振候
Owner 安徽天生新材料有限公司