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A Method of Evaluating the Measurement Accuracy of CT Size Using DVC Deformation Algorithm

A technology of measurement accuracy and deformation algorithm, which is applied in the direction of measurement devices, calculations, 3D modeling, etc., can solve the problems that it is difficult to accurately evaluate the error error, and the CT measurement error cannot be completely traced to the source, so as to achieve a large amount of data, comprehensive and reliable error The effect of data

Active Publication Date: 2022-04-12
SOUTHEAST UNIV
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  • Application Information

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Problems solved by technology

However, it is worth noting that although we know that the above factors all have an impact on the final CT measurement accuracy or error, the CT measurement error is usually not fully traceable, so it is difficult to accurately evaluate the error caused by a single factor and the final measurement error
How to quantify the uncertainty caused by these influencing factors on CT size measurement is a very tricky task

Method used

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  • A Method of Evaluating the Measurement Accuracy of CT Size Using DVC Deformation Algorithm
  • A Method of Evaluating the Measurement Accuracy of CT Size Using DVC Deformation Algorithm
  • A Method of Evaluating the Measurement Accuracy of CT Size Using DVC Deformation Algorithm

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Effect test

Embodiment 1

[0025] In Example 1, taking the CT size measurement accuracy evaluation of metal foam aluminum as an example, the specific implementation process is as follows:

[0026] Step 1. According to the sample to be tested for CT size measurement, prepare a standard sample for size measurement accuracy evaluation. The standard sample used here is the sample to be tested itself, which is a cubic foam with an external dimension of 1.3cm×1.3cm×1.3cm Aluminum samples;

[0027] Step 2. Under a certain CT test condition, the CT equipment is used to scan the sample twice consecutively to obtain two sets of three-dimensional CT image data under the same test condition. The imaging equipment used here is a Zeiss Xradia510 X-ray microscope, and the scanning parameters are : The X-ray accelerating voltage is 140kV, the power is 10w, and the resolution is 13 microns. The typical CT data slice obtained is as follows figure 1 shown;

[0028] Step 3: Use the DVC algorithm to perform DVC calculatio...

Embodiment 2

[0033] Compared with the CT test of embodiment 1, embodiment 2 only changes the voltage and power of CT test conditions, changes 140kV, power 10w to 40kV, 3w, other is the same as embodiment 1; The strain values ​​in the 8 strain windows were statistically analyzed, and a series of standard deviations of the obtained strains along the vertical direction were listed in image 3 .

Embodiment 3

[0035] Compared with embodiments 1 and 2, embodiment 3 changes the voltage and power of the CT test conditions, changes the test voltage and power to 80kV and 7w respectively, and compares the difference between inserting a filter and not inserting a filter, and finally layer by layer Statistical analysis is performed on the strain values ​​in 8×8 strain windows in the horizontal direction, and a series of standard deviations of the obtained strains along the vertical direction are listed in Figure 4~5 .

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Abstract

The invention discloses a method for evaluating the accuracy of CT dimension measurement by using the DVC deformation algorithm, specifically: determining a standard sample for dimension measurement accuracy evaluation according to the material and structure of the sample to be measured for CT dimension measurement; Under the CT test conditions, use CT equipment to scan the standard sample twice consecutively to obtain two sets of three-dimensional CT image data under the same test conditions; perform DVC calculation on the two sets of three-dimensional CT image data obtained to obtain three-dimensional full-field deformation data , the strains in three directions in the deformation data are denoted as ex, ey, ez; statistical analysis is carried out on the obtained full-field deformation data, and the mean value and standard deviation of each strain are obtained. The accuracy of CT size measurement is negatively correlated with the standard deviation, That is, the smaller the standard deviation, the higher the measurement accuracy; the larger the standard deviation, the lower the measurement accuracy. The method of the invention can quantify the influence of various influencing factors on the CT size measurement.

Description

technical field [0001] The invention relates to a method for evaluating the measurement accuracy of CT dimensions, in particular to a method for evaluating the measurement accuracy of CT dimensions with a DVC deformation algorithm. Background technique [0002] Since 2005, the use of three-dimensional nondestructive CT (Computer Tomography, tomography) technology to measure the geometric dimensions of industrial parts has gained more and more attention in the industry. Using CT for geometric dimension measurement of industrial parts is actually using CT as a three-coordinate measuring instrument. Compared with the traditional three-coordinate measuring machine, which can only measure the surface size of the sample, CT can measure the internal size of the sample. However, the measurement accuracy of CT depends heavily on the sample material, size, structure, and the state of the CT equipment, test conditions, reconstruction parameters, etc., so how to systematically evaluate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B15/00G01B15/06G06T17/00
CPCG01B15/00G01B15/06G06T17/00
Inventor 万克树齐龙强
Owner SOUTHEAST UNIV
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