Encapsulation method

Abstract

The invention relates to a packaging method. The encapsulation method is used for encapsulating the light emitting chip on the substrate. The packaging method includes the following steps: S10, providing a substrate; S20, setting a light-shielding member and a plurality of light-emitting chips on the substrate, the light-emitting chips are electrically connected to the substrate, and a plurality of intervals are arranged on the light-shielding member The accommodating grooves provided, the light-emitting chips are arranged in the accommodating grooves and correspond to the accommodating grooves one by one, so that the adjacent light-emitting chips are separated by the light blocking member; S30, for the accommodating The light-emitting chip placed in the groove is sealed with glue. Since the light-blocking member acts as a light-blocking member, the lights emitted by adjacent light-emitting chips will not affect each other, so the lights emitted by adjacent light-emitting chips will not interfere with each other. When the light-emitting chip in the display device is packaged on the substrate by the packaging method, the light emitted by the display device will not cause color deviation due to the mixing of lights of different colors.

Description

technical field [0001] The invention relates to the technical field of semiconductor lighting, in particular to a packaging method. Background technique [0002] LED (Light Emitting Diode), also known as light-emitting diode, is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electricity into light. [0003] For an LED display device, usually a plurality of LED light-emitting chips are packaged on a substrate, and an image is displayed through a dot matrix composed of the LED light-emitting chips. During packaging, the LED light-emitting chip is usually fixed on the substrate, and then the LED light-emitting chip is packaged on the substrate. For a color LED display device, LED light-emitting chips for emitting light of different colors are usually arranged on the substrate. [0004] However, the above packaging process is likely to cause optical crosstalk between adjacent LED light-emitting chips that emit ...

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned packaging process is likely to cause optical crosstalk between adjacent LED light-emitting chips emitting different colors of light.

That is, the light emitted by a certain LED light-emitting chip may interfere with the light emitted by adjacent LED light-emitting chips that emit different colors of light, and the mixing of different colors of light will lead to deviations in the color of the light emitted by the display device.

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