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Imaging module and its forming method, lens assembly

An imaging module and imaging technology, applied in electrical components, image communication, color TV components, etc., can solve the problems of insufficient driving capacity and heavy lens modules, and achieve the effects of light weight, low cost and small size

Active Publication Date: 2022-04-01
NINGBO SEMICON INT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, unlike traditional SLR cameras, it is a huge engineering challenge to implement this function in electronic terminals such as mobile phones, miniature cameras, and cameras with small spaces
Moreover, as the imaging systems of electronic terminals such as mobile phones become more and more complex, and the lens modules become heavier and heavier, the driving capabilities of traditional driving mechanisms such as VCM motors are gradually insufficient.

Method used

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  • Imaging module and its forming method, lens assembly
  • Imaging module and its forming method, lens assembly
  • Imaging module and its forming method, lens assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] Such as figure 1 As shown, this embodiment provides an imaging module, including:

[0064] A moved element 30, the moved element 30 is a lens group, a lens sheet or an aperture;

[0065] a flexible connecting piece 40, the connecting piece 40 includes a first end and a second end, the first end is connected to the moved element 30;

[0066] A piezoelectric element 20 comprising a movable end and a fixed end, the movable end is connected to the second end; when the piezoelectric element 20 is powered on, the movable end is tilted upward or downward relative to the fixed end curved to move the moved element 30;

[0067] A support block 50 is used to support and fix the piezoelectric element 20, and the fixed end is fixed to the support block 50;

[0068] The external signal connection terminal is electrically connected with the electrodes in the piezoelectric element 20 .

[0069] Specifically, such as figure 2 As shown, the piezoelectric element 20 includes a piezo...

Embodiment 2

[0096] The difference from Embodiment 1 is that in this embodiment, if Figure 15 As shown, the piezoelectric element 20 is inserted into the support block 50 for fixing, that is, the support block 50 includes a first layer of support blocks 51 and a second layer of support blocks 52 stacked in sequence from bottom to top, The fixed end of the piezoelectric element 20 is fixed between the first support block 51 and the second support block 52 .

[0097] The support block 50 of the present invention is not limited to only including two layers of support blocks, and may also include one layer, three layers, four layers, five layers, etc., as long as the fixed end of the piezoelectric element 20 is inserted into the support block 50 Just fix it.

[0098] see Figure 15 and figure 2 , the external signal connection end includes a third electrical connection end 61 and a fourth electrical connection end 62, the first lead-out end 251 and the second lead-out end 252 are located ...

Embodiment 3

[0103] The difference from Embodiment 1 and Embodiment 2 is that in this embodiment, the moved element 30 is an imaging sensor element.

[0104] Such as Figure 18 and Figure 19a As shown, the top surface of the piezoelectric element 20 is also provided with a wiring layer 75, the wiring layer 75 is located in the insulating layer 25, and both ends have a first electrical connection terminal 71 exposing the insulating layer 25 and The fifth electrical connection terminal 74 . The first electrical connection end 71 is closer to the moved element 30 than the fifth electrical connection end 74, the upper surface of the moved element 30 is provided with a second electrical connection end 72, the first electrical connection end 71 and the second electrical connection end 72 are electrically connected through a flexible electrical conductor 73, and then a lead wire 76 is used to electrically connect the fifth electrical connection end 74 to the circuit board 10, so that the circu...

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Abstract

The invention provides an imaging module and its forming method, and a lens assembly. A support block supports a piezoelectric element. One end of the piezoelectric element is connected to the moved element, and the other end protrudes from the moved element. An external signal the connecting end is electrically connected to an electrode in the piezoelectric element to energize the piezoelectric element so that one end of the piezoelectric element is warped upward or downward relative to the other end to move the moved element, In this way, the movement requirements of the moved element can be met, and compared with traditional driving mechanisms such as VCM motors, the combination of the piezoelectric element and the support block is light in weight, small in size, simple in structure, low in cost, and can realize multi-dimensional movement , suitable for devices with small spaces such as imaging modules, and the piezoelectric element is driven by pure voltage without electromagnetic interference.

Description

technical field [0001] The invention relates to the technical field of motion control, in particular to an imaging module, a forming method thereof, and a lens assembly. Background technique [0002] In some electronic terminals, it is usually necessary to make some parts thereof translate, move vertically or tilt, so as to realize some special functions. For example, in various electronic terminals such as video cameras, cameras, and mobile phones with lens modules, a driving mechanism such as a VCM motor (Voice Coil Actuator / Voice Coil Motor) is usually used to make the movable lens or image sensor , shift in the direction of the optical axis to focus or zoom, or shift in a direction perpendicular to the direction of the optical axis to prevent optical shake. However, unlike traditional SLR cameras, it is a huge engineering challenge to implement this function in electronic terminals such as mobile phones, miniature cameras, and cameras with small spaces. Moreover, as th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225H04N5/232
CPCH04N23/50H04N23/57H04N23/55H04N23/54H04N23/67H04N23/695
Inventor 桂珞
Owner NINGBO SEMICON INT CORP
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