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Method for improving crystallization of grinding fluid of polishing head

A technology of polishing head and abrasive liquid, which is applied in grinding/polishing equipment, grinding/polishing safety devices, metal processing equipment, etc., and can solve problems such as crystallization of abrasive liquid

Active Publication Date: 2021-02-26
上海中欣晶圆半导体科技有限公司
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Problems solved by technology

[0005] Aiming at the problems existing in the prior art, the present invention provides a method for improving the crystallization of the abrasive liquid on the polishing head, so as to solve the problem of crystallization of the abrasive liquid on the polishing head

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  • Method for improving crystallization of grinding fluid of polishing head

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specific Embodiment 1

[0025] Specific embodiment 1, see figure 1 , a method for improving the crystallization of a polishing head abrasive liquid, comprising the steps of: Step 1, cutting a fine polishing abrasive cloth, using the fine polishing abrasive cloth as a polishing head protection pad 1; Step 2, wiping the surface of the polishing head 2 clean; Step 3, Adhere the cut polishing head protection pad 1 on the upper surface of the polishing head. This patent solves the problem of mechanical damage caused by the crystallization of the polishing head. It solves the difficulty of stopping and maintaining the polishing head and improves the productivity and work efficiency. After the improvement, the maintenance of the polishing head does not need to be shut down for one day per month for maintenance. It only needs to be replaced for about 6 months / time when the polishing head protection pad is damaged and stained during normal work. Easy maintenance. It takes 3-5 minutes to replace a polishing ...

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Abstract

The invention relates to the technical field of semiconductor silicon wafer processing, in particular to a method for improving crystallization of grinding fluid of a polishing head. The method is characterized by comprising the following steps that firstly, fine polishing grinding cloth is cut, and the fine polishing grinding cloth serves as a polishing head protection pad; secondly, the surfaceof the polishing head is wiped clean; and thirdly, the cut polishing head protection pad is pasted to the upper surface of the polishing head. By means of the method, the problem of poor mechanical damage caused by crystallization of the polishing head is solved. The problem that shutdown maintenance of the polishing head is difficult is solved, and productivity and working efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor silicon wafer processing, in particular to a method for improving the crystallization of a polishing head abrasive liquid. Background technique [0002] During the mirror polishing process of semiconductor silicon wafers, the falling of particles is undoubtedly the main cause of mechanical damage. For the mirror polishing process, the area where large particles are most likely to be produced is the crystallization of the abrasive liquid on the polishing head. The crystals of the polishing head accumulate for a long time, reaching a certain thickness, and naturally fall off during the processing of the product, causing mechanical damage. [0003] The maintenance method of the traditional grinding head is 1) stop the polishing head and spread the plastic film on the fixed plate; 2) remove the outer cover of the polishing head; 3) corrode the polishing head with NaOH liquid for 4 hours; 4) rins...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B55/00
CPCB24B55/00
Inventor 尚散散贺贤汉
Owner 上海中欣晶圆半导体科技有限公司
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