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Electronic device and manufacturing method thereof

A technology of electronic devices and circuit boards, applied in the direction of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc.

Pending Publication Date: 2021-03-05
INNOLUX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, it is necessary to propose an electronic device and its manufacturing method to solve the technical problems encountered by existing flexible electronic devices

Method used

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  • Electronic device and manufacturing method thereof
  • Electronic device and manufacturing method thereof
  • Electronic device and manufacturing method thereof

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Embodiment Construction

[0020] In order to enable those skilled in the art to further understand the present invention, the embodiments of the present invention are enumerated below, together with the accompanying drawings, the constitutional content and desired effects of the present invention are described in detail. It should be noted that the accompanying drawings are all simplified schematic diagrams, therefore, only the components and combinations related to the present invention are shown to provide a clearer description of the basic structure or implementation method of the present invention, while the actual components and layout may be more accurate. for complex. In addition, for the convenience of description, the elements shown in the drawings of the present invention are not drawn in proportion to the number, shape, and size of the actual implementation, and the detailed proportions can be adjusted according to design requirements.

[0021] Certain terms will be used in the present descr...

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Abstract

The invention discloses an electronic device and a method of manufacturing the same. The electronic device includes a first flexible substrate, a bonding pad and a first supporting diaphragm, whereinthe bonding pad is located on the first flexible substrate, and the first supporting diaphragm is connected to the first flexible substrate; and the first supporting diaphragm is also provided with afirst opening disposed corresponding to the bonding pad.

Description

technical field [0001] The invention relates to an electronic device and a manufacturing method thereof, in particular to an electronic device with a support film attached to a flexible substrate and a related manufacturing method. Background technique [0002] In the manufacturing process of flexible electronic devices, for example, it is necessary to use a release machine to separate the glass carrier and the flexible substrate, which may cause a problem of lower yield due to insufficient flatness. [0003] Therefore, the technology of flexible electronic devices still needs to be researched and developed in order to overcome the defects of the prior art. Contents of the invention [0004] In view of this, it is necessary to propose an electronic device and a manufacturing method thereof to solve the technical problems encountered by existing flexible electronic devices. [0005] According to an embodiment of the present invention, an electronic device is provided, incl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1333H01L51/00H01L27/32H10K99/00
CPCG02F1/133305G02F1/1333H10K59/00H10K71/50H10K85/00H10K77/111G02F1/13452Y02E10/549Y02P70/50G02F1/133528
Inventor 黄信豪曾宇志赖柜宏
Owner INNOLUX CORP