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Micro light-emitting diode detection device, apparatus and preparation method

A technology of micro-light-emitting diodes and detectors, which is applied in the direction of diode testing, micro-structure devices, and manufacturing micro-structure devices, etc., and can solve problems that affect the production yield of Micro LED display panels, damage Micro LED chips, and affect the display effect of Micro LED display panels, etc.

Pending Publication Date: 2021-03-30
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The inventors found that there are at least the following problems in the prior art: in the prior art, the Micro LED chips provided by the supplier are generally directly transferred in large quantities and bound to the driving substrate without detection and screening
In the mass transfer process, due to control deviations such as pressure and alignment, it is easy to cause damage to a small amount of Micro LED chips, thereby affecting the production yield of Micro LED display panels, and even affecting the display effect of Micro LED display panels.

Method used

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  • Micro light-emitting diode detection device, apparatus and preparation method
  • Micro light-emitting diode detection device, apparatus and preparation method
  • Micro light-emitting diode detection device, apparatus and preparation method

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Embodiment 1

[0046] Figure 2a , Figure 2b A schematic structural diagram of a micro-light-emitting diode detection device provided for an embodiment of the present invention, such as Figure 2a As shown, the micro light emitting diode detection device includes: a substrate 201, and a first through hole 202 and a second through hole 203 penetrating the substrate; the substrate includes a first surface 2011 and a second surface 2012 opposite to each other; the first The through hole 202 and the second through hole 203 are arranged corresponding to the first pole P and the second pole N of the micro light emitting diode to be tested respectively; 2. Testing department. The first detection part includes: a first electrode 2041 located on the first surface 2011 of the substrate 201, a second electrode 2042 located between the first electrode 2041 and the first via hole 202, and a fixed connection with the first electrode 2041. The third electrode 2043 . The third electrode 2043 includes: ...

Embodiment 2

[0066]Based on the same inventive concept, an embodiment of the present invention provides a micro-LED detection device, which may include the micro-light-emitting diode detection device provided in the above embodiment. It can be understood that the number of micro-light-emitting diodes to be detected can be multiple, which can be huge in practical applications, and the number of micro-light-emitting diode detection devices in the corresponding micro-light-emitting diode detection device can also be multiple, And it corresponds to the micro light emitting diodes to be tested one by one. At the same time, a plurality of micro light emitting diode detection devices are distributed in an array.

[0067] It should be noted that the implementation principle of the micro-LED detection device provided in the embodiment of the present invention is similar to that of the micro-LED detection device provided in the above-mentioned embodiments, and will not be repeated here.

Embodiment 3

[0069] Based on the same inventive concept, an embodiment of the present invention provides a method for preparing a micro-light-emitting diode detection device, image 3 A schematic flow chart of a method for preparing a micro-light-emitting diode detection device provided in an embodiment of the present invention, as shown in image 3 As shown, the preparation method of the micro-light-emitting diode detection device includes the following steps:

[0070] S301, forming a first through hole and a second through hole penetrating through the substrate on the substrate.

[0071] Such as Figure 4a As shown, in the embodiment of the present invention, a first through hole 202 and a second through hole 203 are formed on the substrate 201, and the first through hole 202 and the second through hole 203 are connected to the first electrode of the micro light emitting diode to be tested. P and the second pole N correspond to each other. The substrate 201 includes a first surface 20...

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Abstract

The invention provides a micro light-emitting diode detection device, apparatus and a preparation method, belongs to the technical field of display, and can solve the problem that the manufacturing yield of a display panel is easily influenced by the damage of a micro light-emitting diode due to the fact that the micro light-emitting diode is directly transferred and bound on a large scale in theprior art. The micro light-emitting diode detection device comprises a substrate, a first through hole and a second through hole, wherein the first through hole and the second through hole penetrate through the substrate; the substrate comprises a first surface and a second surface which are oppositely arranged; the first through hole and the second through hole are respectively arranged corresponding to the first pole and the second pole of the micro light-emitting diode to be measured; and the device further comprises a first detection part and a second detection part which are located on the first surface of the substrate.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a micro-light-emitting diode detection device, device and preparation method. Background technique [0002] The micro light emitting diode (Micro LED) display technology is to shrink the size of the existing light emitting diode (LED) to less than 100 microns (μm), and its size can be 1 of the size of the existing LED. %, micron-scale Micro LED chips can be transferred and bonded to the driving substrate through mass transfer technology, thereby forming Micro LED display panels of various sizes. [0003] The inventors have found that at least the following problems exist in the prior art: in the prior art, the Micro LED chips provided by the supplier are generally directly mass-transferred and bound to the driving substrate without detection and screening. During the mass transfer process, due to control deviations such as pressure and alignment, it is easy to cause...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81C1/00H01L21/66H01L23/544
CPCH01L22/14H01L22/34B81C1/0015B81B7/02B81C2203/01B81B2201/014H01L33/62H01L2933/0066G01R31/2635H01L33/0095H01L25/0753
Inventor 梁志伟罗雯倩焦士搏王峰刘英伟
Owner BOE TECH GRP CO LTD