Touch device and manufacturing method thereof

Abstract

The invention provides a touch device. The touch device comprises a shell, a touch sensor and a circuit board. The shell is provided with an accommodating space and an opening. The touch sensor is arranged in the accommodating space. The touch sensor comprises a substrate, a plurality of first metal pads and a sensing layer. The substrate is arranged in the accommodating space and corresponds to the shell in shape. The sensing layer is disposed on the substrate and electrically connected to the plurality of first metal pads. The circuit board is arranged at the position, close to the opening, of the shell and provided with a plurality of second metal pads, and the second metal pads face the accommodating space and are electrically connected with the first metal pads respectively. According to the touch device, a frame does not need to be reserved for wiring arrangement, and full-screen touch can be achieved.

Description

technical field [0001] The invention relates to a touch device, in particular to a frameless three-dimensional touch device and a manufacturing method thereof. Background technique [0002] In recent years, touch devices are widely used in various electronic devices, such as mobile electronic devices such as mobile phones, digital cameras, and tablet computers. Compared with traditional physical buttons, the touch device is more convenient to use, and users can directly slide their fingers on the touch device to input various operation instructions. [0003] figure 1 A first conventional touch device 100 is shown. In the touch device 100 , the light emitting diode 104 and the touch sensor 106 are disposed on the substrate 102 and electrically connected to a circuit board (not shown in the figure) through the trace 108 . The plastic resin 110 covers the LED 104 and the touch sensor 106 . There is a pattern layer on the plastic resin 110 , and the pattern layer includes a ...

AI Technical Summary

Problems solved by technology

However, if the touch device 400 is molded after the pin header 420 is fixed, the mold needs to avoid the pin header 420 to prevent the mold from being pressed against the pin header 420 due to deviation, resulting in 420 deformation or glue overflow problem

On the contrary, if the touch device 400 undergoes a molding process first and then fixes the pin header 420, it is necessary to avoid the pad area of ​​the pin header during the molding process, and then fix the pin header 420 with conductive adhesive and epoxy resin. , as a result, subsequent processing and rework of defective products are more difficult

In addition, the touch device 400 also needs to reserve a frame as the wiring hub area 422, which makes the touch device 400 unable to achieve full-screen touch control.

[0007] Conventional touch devices 100, 200, 300, and 400 all need to reserve a frame to design the routing area, so full-screen touch cannot be achieved

In addition, the conventional touch devices 100, 200, 300, and 400 still have problems with the electrical connection stacking of in-mold electronic components and the manufacturing process.

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