Radio frequency front end module and wireless communication device

A radio frequency front-end and module technology, applied in the field of radio frequency communication, can solve the problems of power amplifier load line impedance and insertion loss, etc., to achieve flexible design, reduce impedance, and meet the effect of integration

Active Publication Date: 2021-06-11
RADROCK (SHENZHEN) TECH CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The embodiment of the present invention provides a radio frequency front-end module and a wireless communication device t

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  • Radio frequency front end module and wireless communication device
  • Radio frequency front end module and wireless communication device
  • Radio frequency front end module and wireless communication device

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0040] It should be understood that the invention can be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity, and like reference numer...

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Abstract

The invention discloses a radio frequency front-end module and a wireless communication device. The radio frequency front-end module comprises a substrate, a push-pull power amplifier chip and a power supply end, the push-pull power amplifier chip and the power supply end are arranged on the substrate, the push-pull power amplifier chip comprises a first differential amplification circuit, the first differential amplification circuit comprises a first differential transistor and a second differential transistor, the first differential transistor is configured to amplify a first radio frequency signal, and the second differential transistor is configured to amplify a second radio frequency signal; the output end of the first differential transistor is connected to the power supply end through a first metal wire arranged on the substrate, and the output end of the second differential transistor is connected to the power supply end through a second metal wire arranged on the substrate. The equivalent inductor formed by the first metal wire and the second metal wire is used for replacing the first inductor and the second inductor which are actually existing, impedance and insertion loss in the feeding process are reduced, the area of the radio frequency front-end module is reduced, and therefore the power conversion efficiency and the output power of the radio frequency front-end module are guaranteed.

Description

technical field [0001] The invention relates to the technical field of radio frequency communication, in particular to a radio frequency front-end module and a wireless communication device. Background technique [0002] The RF front-end is between the antenna and the RF transceiver, and is the core component of electronic terminal communication. The RF front-end includes filters, LNA (short for Low Noise Amplifier, low noise amplifier), PA (short for Power Amplifier, power amplifier), switches, and antenna tuning. The power amplifier is the core active device of the radio frequency front end, through which the electronic terminal can obtain higher radio frequency output power. The key performance goal of the fifth-generation mobile communication technology (5G) is to greatly increase the transmission rate compared with 4G. The 5G new technology needs to adopt a radio frequency front-end with higher frequency, larger bandwidth, and higher-order QAM modulation, so that it is...

Claims

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Application Information

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IPC IPC(8): H04B1/40H04B1/401
CPCH04B1/40H04B1/401Y02D30/70
Inventor 曹原戎星桦雷传球倪建兴
Owner RADROCK (SHENZHEN) TECH CO LTD
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