Embedded injection-molding placement method

Abstract

The invention discloses an embedded injection-molding placement method. The embedded injection-molding placement method comprises the following steps: 1) designing hardware, and producing a mold according to the hardware; 2) selecting an injection-molding mold as the mold, and arranging an injection-molding charging point on the injection-molding mold to be a protruding material nozzle; 3) preparing materials, namely preparing cloth, and cutting off the outer contour of the cloth and the position corresponding to the loading nozzle in the mold; 4) putting the prepared materials; placing the cloth cut in the step 3) into the mold, enabling a hole position on the cloth to correspond to the material nozzle, and carrying out mold closing injection-molding after the prepared materials are placed; and 5) opening the mold and taking a finished product. According to the embedded injection-molding placement method, the cloth is located and placed, so that the falling point is accurate when firmware is placed. The materials easy to cool and cure are adopted, and fast material solidification and product forming are achieved. Compared with a traditional placement process, the time for placing a plurality of pieces of hardware on the cloth can be saved by 80%-90% or above.

Description

technical field [0001] The invention relates to the technical field of hardware placement on cloth, in particular to an embedded injection molding placement method. Background technique [0002] The existing methods for placing hardware on fabrics include drop plastic technology, which uses thermoplastic polymer materials with variable state characteristics, that is, viscous fluidity under certain conditions, and the characteristics of returning to solid state at room temperature. And use appropriate methods and special tools to inkjet, mold it into the designed shape as required in its viscous flow state, and then solidify it at room temperature. [0003] However, plastic drop technology has the characteristics of cumbersome procedures, and the hardware produced is mostly decorative parts, because the product process is mainly stacked cooling and solidification, which has greatly restricted the production of functional hardware. (Functional hardware is mostly a three-dimen...

AI Technical Summary

Problems solved by technology

[0003] However, plastic drop technology has the characteristics of cumbersome procedures, and the hardware produced is mostly decorative parts, because the product process is mainly stacked cooling and solidification, which has greatly restricted the production of functional hardware.

(Most of the functional hardware is a three-dimensional structure with unequal top and bottom, and the corresponding hardware appearance cannot be made by stacking, cooling and solidifying)

When placing the hardware on the fabric, it is necessary to use a hot pressing process (high frequency process). The secondary processing will cause instability to the accuracy of the hardware placement, and there are many disadvantages.

Images