Semiconductor device and manufacturing method thereof
A semiconductor and device technology, applied in the field of semiconductor devices and their manufacturing, can solve difficult design and manufacturing problems
Pending Publication Date: 2021-06-29
TAIWAN SEMICON MFG CO LTD +2
0 Cites 0 Cited by
AI-Extracted Technical Summary
Problems solved by technology
View more
Abstract
The invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a substrate; a first gate structure, a second gate structure and a third gate structure; and a first source/drain region. The first gate structure, the second gate structure and the third gate structure are over the substrate and arranged along a first direction. The first gate structure, the second gate structure and the third gate structure extend in a second direction different from the first direction, and the second gate structure is between the first gate structure and the third gate structure. The first source/drain region is between the first gate structure and the third gate structure and at one end of the second gate structure.
Application Domain
TransistorSolid-state devices +3
Technology Topic
EngineeringDevice material +3
Image
Examples
- Experimental program(20)
Example
Example
Example
PUM


Description & Claims & Application Information
We can also present the details of the Description, Claims and Application information to help users get a comprehensive understanding of the technical details of the patent, such as background art, summary of invention, brief description of drawings, description of embodiments, and other original content. On the other hand, users can also determine the specific scope of protection of the technology through the list of claims; as well as understand the changes in the life cycle of the technology with the presentation of the patent timeline. Login to view more.