Aluminum-based copper-clad plate with high heat dissipation performance

Abstract

The invention discloses an aluminum-based copper-clad plate with high heat dissipation performance. The aluminum-based copper-clad plate comprises an aluminum-based copper-clad plate body and further comprises a heat dissipation mechanism; the heat dissipation mechanism is composed of an end plate A, an end plate B, a connecting plate, a copper rod and copper foils; the end plate A and the end plate B are symmetrically arranged on the surface of one side of the aluminum-based copper-clad plate body, and the connecting plate is fixedly connected between the end plate A and the end plate B; the copper rod is fixedly connected between the bottom end of the connecting plate and the aluminum-based copper-clad plate; the copper foils are attached to the surfaces of the end plate A, the end plate B and the connecting plate; a heat dissipation mechanism is arranged on the surface of the aluminum-based copper-clad plate, the end plate A and the end plate B of the heat dissipation mechanism are matched with the connecting plate and the copper rod, and a gap layer is formed on the surface of the aluminum-based copper-clad plate; and the copper foils cover the surfaces of the end plate A, the end plate B and the connecting plate, so that the surface of the aluminum-based copper-clad plate is provided with the convex heat dissipation mechanism with a gap, and the heat dissipation mechanism can assist the aluminum-based copper-clad plate to dissipate heat from the gap.

Description

technical field [0001] The invention relates to the technical field of aluminum-based copper-clad laminates, in particular to an aluminum-based copper-clad laminate with strong heat dissipation. Background technique [0002] Aluminum-based copper-clad laminate, that is, aluminum substrate, is a kind of raw material. It is made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, single resin, etc. And a plate-like material made is called copper-clad laminated aluminum substrate, or aluminum-based copper-clad laminate for short. [0003] Patent No. CN201921111124.1 discloses a high heat dissipation metal aluminum-based copper clad laminate, including an aluminum base layer, a heat dissipation mechanism is provided inside the aluminum base layer, and a heat conduction layer is provided on both outer surfaces of the aluminum base layer, and the outer sides of the two heat conduction layers Copper foil is provided, and one end of the aluminum b...

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Problems solved by technology

[0004] 1. The structure of the aluminum-based copper-clad laminate in the prior art is simple. When the aluminum-based copper-clad laminate is used, the surface of the plate body lacks a good heat dissipation mechanism, which makes the aluminum-based copper-clad laminate easy to generate high heat when it is used. Therefore, We propose an aluminum-based copper-clad laminate with strong heat dissipation

[0005] 2. The hierarchical structure of the aluminum-based copper-clad laminates in the prior art is simple and lacks a good internal fixing mechanism. When the aluminum-based copper-clad laminates are stressed, they are easily deformed and damaged, thereby affecting the use of the plates. Therefore, we propose a Aluminum base copper clad laminate with strong heat dissipation

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