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Detection system

An inspection system and technology to be inspected, applied in the field of inspection systems, can solve problems such as inability to detect internal defects in optical components above the height information of components on the board

Pending Publication Date: 2021-08-10
深圳市华讯方舟光电技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the prior art, industrial cameras and imaging lenses are usually used to take pictures of the circuit board to be tested, and then identify defects through the captured images, which can only provide two-dimensional information on the surface of the circuit board, but cannot determine the height information of the components on the board, the upper surface, etc. Further inspection of internal defects of optical components

Method used

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Embodiment Construction

[0042] In order to enable those skilled in the art to better understand the technical solution of the present application, the detection system provided by the present application will be further described in detail below in conjunction with the drawings and specific embodiments. It should be understood that the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0043] The terms "first", "second", etc. in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps ...

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Abstract

The invention discloses a detection system. The detection device is used for detecting a to-be-detected target, and comprises: an optical device disposed on the to-be-detected target and used for receiving first reflected light and second reflected light reflected by the to-be-detected target; a visible light imaging device for receiving the first reflected light through the optical device so as to obtain the image of the to-be-detected target; and an OCT imaging device for outputting the detection light to the to-be-detected target through the optical device and receiving the second reflected light from the optical device so as to obtain parameters of the to-be-detected target. By arranging the optical device, the first reflected light emitted by the to-be-detected target is transmitted to the visible light imaging device, so that two-dimensional imaging of the to-be-detected target is realized; and second reflected light emitted by the to-be-detected target is transmitted to the OCT imaging device, depth information of the to-be-detected target is obtained, and two-dimensional and three-dimensional scanning detection is achieved.

Description

technical field [0001] The present application relates to the field of circuit board detection, in particular to a detection system. Background technique [0002] In the detection of printed circuit boards, it is often necessary to detect the wiring, electronic components, and optical components on the circuit board, which usually requires computer vision systems to identify and detect them. In the prior art, industrial cameras and imaging lenses are usually used to take pictures of the circuit board to be tested, and then identify defects through the captured images, which can only provide two-dimensional information on the surface of the circuit board, but cannot determine the height information of the components on the board, the upper surface, etc. The internal defects of optical components are further inspected. Contents of the invention [0003] The present application provides a detection system, the detection device is used to detect the target to be detected, inc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/95G01N21/01G01S17/894G01S17/08G01S7/481
CPCG01N21/95G01N21/01G01S17/894G01S17/08G01S7/4817
Inventor 苏胜飞田井宇
Owner 深圳市华讯方舟光电技术有限公司