Collimating film, interference-reducing collimating film, preparation method of interference-reducing collimating film, laminated collimating film and image recognition module

A bonding and modular technology, applied in the field of image recognition, which can solve the problem of difficult alignment of two-layer collimating diaphragms

Active Publication Date: 2021-08-24
NINGBO EXCITON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of difficult alignment of the two layers of collimating diaphragms in the traditional rigid collimating sheet, the present invention provides a collimating film, a collimating film for reducing interference and its preparati

Method used

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  • Collimating film, interference-reducing collimating film, preparation method of interference-reducing collimating film, laminated collimating film and image recognition module
  • Collimating film, interference-reducing collimating film, preparation method of interference-reducing collimating film, laminated collimating film and image recognition module
  • Collimating film, interference-reducing collimating film, preparation method of interference-reducing collimating film, laminated collimating film and image recognition module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0183] Such as Figure 6 Shown is the collimating film provided by the present invention, including a collimating lens layer 41, a flexible substrate layer 42 and a collimating hole layer 43, the collimating lens layer is placed on the upper surface of the substrate, and the collimating hole layer is placed on the lower surface of the substrate , the collimating lens layer 41 includes a microlens array 41A and a thickness 41B, and the collimating hole layer 43 includes a light-shielding medium 43A and a collimating hole array (consisting of a certain number of collimating holes 43B) formed after hollowing out the medium; The thickness T of the flexible base layer is 25 μm. The collimating lens array and the collimating hole array of the collimating film are regular triangles closely arranged (such as Figure 8 shown). The minimum pitch P of the main optical axis of the microlens is 18 μm, the radius of curvature R is 12.6 μm, the thickness H of the collimating lens layer is ...

Embodiment 2-24

[0195] For the collimating film provided in Example 1, the collimating lens array and the collimating hole array in the collimating film are closely arranged in regular triangles, the material of the collimating lens layer 41 is PMMA, and the flexible matrix layer 42 The material is PET, and the light-shielding medium 43A of the collimating hole layer 43 is titanium carbide with inorganic coating. The collimating film adopts the microlens punching method to drill collimating holes 43B. The other parameters are listed in Table 1.

[0196] Design parameters and optical properties of Table 1 Embodiment 1~24

[0197]

[0198] Note 1: P is the minimum distance between the main optical axes of the microlens, in μm; R is the radius of curvature of the microlens, in μm; H is the thickness of the collimating lens layer, in μm; n1 is the refractive index of the collimating lens layer, infinite T is the thickness of the flexible base layer, in μm; n2 is the refractive index of the fle...

Embodiment 25-30

[0201] For the collimating film provided in Example 1, the collimating lens array and the collimating hole array in the collimating film are closely arranged in regular triangles, the material of the collimating lens layer 41 is PMMA, and the material of the flexible base layer 42 is It is PET, and the light-shielding medium 43A of the collimating hole layer 43 is titanium carbide with inorganic coating. The collimating film adopts the microlens punching method to punch the collimating hole 43B. The other parameters are listed in Table 2.

[0202] Design parameters and optical properties of table 2 embodiment 25~30

[0203]

[0204] Note 1 is the same as Table 1.

[0205] As shown in Table 2, it is Examples 25-30 with different flexible substrate thicknesses. Examples 25-27 are respectively P=10 μm, and other parameters are constant, and a group of collimating films of T=10, 15, and 20 μm. Embodiments 28-30 are respectively P=25 μm, and other parameters are constant. Belo...

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Abstract

The invention belongs to the field of image recognition, and particularly relates to a collimating film, an interference-reducing collimating film, a preparation method of the interference-reducing collimating film, an attached collimating film and an image recognition module. In order to solve the problem that two layers of collimating diaphragms in a traditional rigid collimating sheet are difficult to align, the invention provides a collimating film, an interference-reducing collimatingfilm, an attached collimating film, an image recognition module and a preparation method thereof. The interference reducing collimating film sequentially comprises a collimating lens layer, a flexible substrate layer and a collimating hole layer. The collimating lens layer comprises a micro-lens array and a lens layer; the collimating hole layer comprises a collimating hole array; and the micro-lens array of the collimating lens layer is arranged in a disordered manner. The interference-reducing collimating film provided by the invention can reduce the light interference phenomenon and improve the image recognition accuracy. The image recognition module provided by the invention is high in recognition accuracy and can be applied to fingerprint unlocking and the like of consumer electronic products such as mobile phones (OLED screens).

Description

technical field [0001] The invention belongs to the field of image recognition, and in particular relates to a collimation film, an interference-reducing collimation film and a preparation method thereof, a bonding type collimation film, and an image recognition module. Background technique [0002] In the field of image recognition, commonly used image sensors such as CMOS type or photo-TFT type generally contain collimation devices in the sensor module to enhance the signal-to-noise ratio, improve the recognition rate, and reduce crosstalk. The function of the collimation device (such as figure 1 shown) is mainly to collimate and filter the diffuse light at the single pixel of the image, and the normal collimated light or light (signal) close to collimation can be smoothly transmitted to the corresponding photoelectric sensor, and the deviation from the normal Directional high-angle light (noise) can only rarely or even not enter the non-corresponding photoelectric sensor...

Claims

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Application Information

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IPC IPC(8): G02B27/30G02B3/00G06K9/00
CPCG02B3/0037G02B3/0006G02B3/00G02B1/10G02B27/30C09J7/29Y02E10/549Y02P70/50
Inventor 唐海江夏寅高斌基付坤王小凯钟林李刚张彦
Owner NINGBO EXCITON TECH
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