Multi-chip device and chip upgrading method
A multi-chip and chip technology, applied in software deployment, version control, instruments, etc., can solve the problems of long time-consuming, time-consuming, and low-efficiency upgrades
Pending Publication Date: 2021-09-07
SHENZHEN CHUANGCHENG MICROELECTRONICS
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Problems solved by technology
Among them, for the upgrade of unpacking and removing the chip, the upgrade operation is cumbersome, time-consuming and labor-intensive, and the upgrade efficiency is low; for the upgrade of the external communication interface, it takes a lot of time to connect multiple communication interfaces one by one to upgrade; For the upgrade of forwarding, the more chips, the higher the redundancy, the longer the upgrade time, and once the communication of the chip used to receive the upgrade data and forward it is abnormal, the entire upgrade will fail
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[0051] It should be noted that the use of step numbers (letters or numbers) in the present invention to refer to some specific method steps is only for the purpose of convenience and brevity in description, rather than limiting these method steps with letters or numbers Order. Those skilled in the art can understand that the sequence of relevant method steps should be determined by the technology itself and should not be unduly limited due to the existence of step numbers.
[0052] Please refer to figure 1 , the multi-chip device of this embodiment includes a plurality of chips, each of which includes a plurality of internal communication interfaces 120, and at least two of the chips include external communication interfaces 110;
[0053] Among the at least two chips comprising the external communication interface 110, each internal communication interface 120 of each chip is communicatively connected with an internal communication interface 120 of one other chip 200 in the p...
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The invention provides a multi-chip device and a chip upgrading method, the multi-chip device comprises a plurality of chips, each chip comprises a plurality of internal communication interfaces, and at least two chips comprise external communication interfaces; in at least two chips comprising external communication interfaces, each internal communication interface of each chip is in communication connection with one internal communication interface of another chip in the plurality of chips to form an internal communication channel; at least two chips including external communication interfaces are divided into a main chip and at least one standby main chip, the external communication interface of the main chip can be in communication connection with an upper computer, and when the external communication interface of the main chip fails to be in communication connection with the upper computer, at least one standby main chip can be in communication connection with the upper computer to become a new main chip. A plurality of chips in the multi-chip device are upgraded through the external communication interface of the main chip in combination with a standby mechanism, and it is ensured that all the chips in the multi-chip device are successfully, rapidly and efficiently upgraded.
Description
technical field [0001] The invention relates to the field of chip technology, in particular to a multi-chip device and a chip upgrading method. Background technique [0002] With the development of the Internet of Things, various terminal electronic products are becoming more and more intelligent and complex. In many cases, one chip can no longer meet the product requirements; therefore, it has become an electronic Product development trends. [0003] At present, there are mainly three ways to upgrade each chip in an electronic product: one is to disassemble the shell of the electronic product, and then remove the chip to burn and upgrade; the other is to externally transmit the upgrade data to each chip on the surface of the electronic product The communication interface is upgraded; the third is to sequentially forward and upgrade the upgrading data according to the connection relationship between the chips as disclosed in the patent CN103970578B. Among them, for the upg...
Claims
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IPC IPC(8): G06F8/65G06F8/71G06F15/78
CPCG06F8/65G06F8/71G06F15/7807
Inventor 梁小江易为苏攀黄祯福蒲莉娟
Owner SHENZHEN CHUANGCHENG MICROELECTRONICS