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Bulk acoustic wave resonator assembly, manufacturing method thereof, filter and electronic equipment

A technology of bulk acoustic wave resonators and components, applied in electrical components, impedance networks, etc., can solve problems such as high stress, failure reliability of resonators and filters, and easy cracking of bending parts.

Active Publication Date: 2021-10-12
ROFS MICROSYST TIANJIN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the non-straight structure of the piezoelectric film or piezoelectric layer, the stress inside, especially the curved part of the film (such as the piezoelectric layer at the edge of the bottom electrode) is very large; during the working process, part of the acoustic energy of the resonator is transmitted to The bending part of the piezoelectric film causes it to generate strong mechanical vibration; in the absence of external structural support in the bending part of the piezoelectric film, the bending part is very easy to break, making the resonator and filter invalid (poor reliability)

Method used

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  • Bulk acoustic wave resonator assembly, manufacturing method thereof, filter and electronic equipment
  • Bulk acoustic wave resonator assembly, manufacturing method thereof, filter and electronic equipment
  • Bulk acoustic wave resonator assembly, manufacturing method thereof, filter and electronic equipment

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Embodiment Construction

[0045] The technical solutions of the present invention will be further specifically described below through the embodiments and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals designate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept of the present invention, but should not be construed as a limitation of the present invention. Some, but not all, embodiments of the invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0046] At first, the reference numerals in the accompanying drawings of the present invention are explained as follows:

[0047] 100: a substrate, which is a device substrate, and the optional materials are monocrystal...

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Abstract

The invention relates to a bulk acoustic wave resonator assembly and a manufacturing method. The assembly includes: a substrate; an acoustic mirror cavity; at least two resonance structures which share the same piezoelectric layer and the substrate; and a supporting layer arranged between the substrate and the piezoelectric layer, wherein the piezoelectric layer is a single-crystal piezoelectric layer, the piezoelectric layer and the substrate are arranged in parallel in a spaced mode, and the supporting layer defines at least a portion of a boundary of the acoustic mirror cavity. The invention also relates to a filter and an electronic device.

Description

technical field [0001] Embodiments of the present invention relate to the field of semiconductors, and in particular to a bulk acoustic wave resonator component, a method for manufacturing a bulk acoustic wave resonator component, a filter with the component, and an electronic component with the component or filter equipment. Background technique [0002] Generally, among the filters prepared based on the piezoelectric film and electrode layer-by-layer growth process, the substrate 100 of the known filter composed of several individual acoustic wave resonators has the following features: Figure 1A The top view structure shown. along Figure 1A The straight line AA' in the cut, can get as follows Figure 1B The sectional structure or cross-sectional structure shown. [0003] Figure 1A and 1B The filter shown in includes several individual acoustic wave resonators, and the specific structure of each resonator includes a substrate 100; cavity-type acoustic mirrors 111, 112...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/007H03H3/02H03H9/02H03H9/13H03H9/15H03H9/17H03H9/46H03H9/48H03H9/54
CPCH03H3/0075H03H3/02H03H9/02118H03H9/02H03H9/02228H03H9/02393H03H9/131H03H9/15H03H9/174H03H9/175H03H9/462H03H9/485H03H9/547H03H2003/025H03H2003/027H03H2003/028H03H2003/023H03H2009/02196H03H2009/155
Inventor 张孟伦庞慰牛鹏飞
Owner ROFS MICROSYST TIANJIN CO LTD