Chip packaging structure, chip packaging method, and optical computing device

Abstract

Embodiments of the present application provide a chip packaging structure, a chip packaging method, and an optical computing device. Wherein, the structure includes: a circuit board, a chip socket mounted on the circuit board, and a photonic chip mounted on the chip socket; the chip socket includes a plurality of elastic electrical connectors, a first pressing member and a second pressing member the first pressing part and the second pressing part are formed separately; the plurality of elastic electrical connecting parts are located between the circuit board and the photonic chip which are arranged oppositely, and the elastic electrical Both ends of the connector are in electrical contact with the circuit board and the photonic chip respectively; the first pressing member is pressed on the edge region of the photonic chip, and the second pressing member is pressed on the photonic chip the central area of ​​the chip, so that the elastic electrical connector is in a compressed state. The technical solutions provided in the embodiments of the present application can easily control and obtain favorable deformation conditions, so as to achieve better optical coupling efficiency.

Description

technical field [0001] The present application relates to the field of semiconductor technology, and in particular, to a chip packaging structure, a chip packaging method, and an optical computing device. Background technique [0002] Compared with traditional electronic chips, photonic chips realize data transmission and processing by manipulating optical signals, and photonic chips (or optical chips) have the advantages of high speed, low delay, and low power consumption. [0003] Typically, a photonic chip is packaged by a photonic bare chip and a light source (eg, a small laser) that provides the photonic bare chip with an optical signal. The coupling efficiency of the light emitted by the light source into the photonic die is a key factor limiting how much light can enter the interior of the photonic die. SUMMARY OF THE INVENTION [0004] The embodiments of the present application provide a chip packaging structure, a chip packaging method, and an optical computing d...

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Problems solved by technology

[0004] The embodiment of the present application provides a chip packaging structure, a chip packaging method, and an optical computing device, which are used to solve the problem of the photonic chip caused by the pressing force of the chip socket on the photonic chip when the chip socket is used to install the photonic chip on the circuit board. The problem of inefficient optical coupling caused by deformation

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