A printed circuit board ink flattening device
A printed circuit board and ink technology, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve problems such as circuit boards are prone to defects, circuit board ink bulges, and affect products, so as to reduce ink The effect of protruding, reducing waste of resources and improving product quality
Active Publication Date: 2022-02-15
四川英创力电子科技股份有限公司
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Problems solved by technology
[0002] With the rapid development of printed circuit boards, the quality requirements for circuit boards in electronic products are also getting higher and higher. The existing production methods are to directly print ink on the surface of the circuit board after plugging the holes, and the guide of the circuit board The fullness of the through hole is generally higher after the hole is plugged. After the hole is plugged, the surface of the circuit board is prone to ink protrusions, and the circuit board is prone to defects when pasting electronic components, which directly affects the appearance and quality of the product. In order to improve Product quality, reduce waste, so a device that can automatically level the circuit board is needed to reduce the phenomenon of ink protrusion on the circuit board
Method used
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[0037] The specific implementation is described as follows:
[0038] First, according to the size of the printed circuit board, adjust the distance between the two conveying units, start the first motor 219, and drive the first screw mandrel 218 to rotate. Since the two sections of the screw thread of the first screw mandrel 218 rotate in opposite directions, the set The two support plates 201 on the first screw mandrel 218 move a predetermined distance towards each other, and simultaneously, because an arc-shaped plate 224 is arranged inside the support plate 201, it is possible to prevent the roller 202 from slipping on the rotating shaft 208, and then the printed circuit board is removed from the One end of the conveying mechanism 200 enters, starts the fourth motor 223, drives the first transmission shaft 222 to rotate, drives the rotating shaft 208 to rotate under the drive of the belt, and the roller 202 on the rotating shaft 208 rotates accordingly;
[0039] Pushed by t...
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An ink flattening device for a printed circuit board, comprising a mounting frame, a conveying mechanism, a film rolling mechanism, and a flattening mechanism; the mounting frame includes two symmetrically arranged mounting plates; the conveying mechanism includes two adjacently arranged conveying components, each It is installed between two mounting boards and is used to convey printed circuit boards. The conveying assembly includes two symmetrically arranged conveying units, and the distance between the two conveying units is adjustable. There is also a limit position along the length direction above the supporting plate. Components; the roll film mechanism includes an upper roll film assembly and a lower roll film assembly arranged symmetrically up and down, both of which are located on one side of the conveying mechanism and fixed on one of the mounting plates for winding the protective film; the flattening mechanism includes a Two flattening components and two linear components between the two conveying components, the flattening components are installed on the linear components for flattening the ink on the printed circuit board; at the same time, the upper and lower surfaces of the circuit board are flattened, Reduce the occurrence of ink protrusion on the circuit board and improve product quality.
Description
technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to an ink flattening device for printed circuit boards. Background technique [0002] With the rapid development of printed circuit boards, the quality requirements for circuit boards in electronic products are also getting higher and higher. The existing production methods are to directly print ink on the surface of the circuit board after plugging the holes, and the guide of the circuit board The fullness of the through hole is generally higher after the hole is plugged. After the hole is plugged, the surface of the circuit board is prone to ink protrusions, and the circuit board is prone to defects when pasting electronic components, which directly affects the appearance and quality of the product. In order to improve Improve product quality and reduce waste, so a device that can automatically level the circuit board is needed to reduce the phenomenon of ...
Claims
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IPC IPC(8): H05K3/00H05K3/22
CPCH05K3/00H05K3/22
Inventor 牟玉贵李清华张仁军胡志强杨海军邓岚
Owner 四川英创力电子科技股份有限公司