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Evaporator, condenser and heat dissipation device

An evaporator and condenser technology, applied in the field of condensers, heat sinks, and evaporators, can solve the problems of insufficient heat dissipation area of ​​the radiator of the chip body, limiting the space of the radiator of the chip body, etc.

Pending Publication Date: 2022-02-22
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the demand for equipment miniaturization and compactness limits the space of the heat sink of the chip body, resulting in insufficient heat dissipation area of ​​the heat sink of the chip body

Method used

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  • Evaporator, condenser and heat dissipation device
  • Evaporator, condenser and heat dissipation device
  • Evaporator, condenser and heat dissipation device

Examples

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Embodiment Construction

[0059] In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.

[0060] In order to facilitate understanding of the evaporator, condenser, and heat dissipation device provided in the embodiments of the present application, the application scenarios thereof are firstly introduced below.

[0061] The heat dissipation device provided in the embodiment of the present application includes an evaporator and a condenser, and can be specifically used to dissipate heat for chips of electronic equipment such as servers. The heat dissipation device may be a remote thermosiphon heat dissipation device to realize remote heat dissipation of the chip. During the working process, the evaporator of the cooling device is in contact with the heat source, specifically, it can be in contact with the chip; as for the condenser in a cold environment, it can be ...

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Abstract

The invention provides an evaporator, a condenser and a heat dissipation device. The heat dissipation device comprises the evaporator and the condenser, and a first supporting structure of the evaporator comprises a plurality of first flow channels and further comprises a first communicating channel communicating with the first flow channels so that steam in the evaporator can be rapidly discharged out of the evaporator, and condensate can be evenly distributed; the condition that condensate is evaporated to dryness is reduced, and the heat exchange effect and the temperature uniformity of the evaporator are improved. The second supporting structure of the condenser comprises a plurality of second flow channels and further comprises a second communicating channel communicating with the second flow channels, so that steam in the condenser is evenly distributed, condensate is rapidly discharged out of the condenser, thermal resistance formed by the condensate is reduced, and the heat exchange effect of the condenser is improved.

Description

technical field [0001] The present application relates to the technical field of heat dissipation, and in particular to an evaporator, a condenser and a heat dissipation device. Background technique [0002] With the gradual increase in people's demand for computing power, the chip power consumption of servers, switches and other information communication equipment is increasing day by day, which puts forward higher requirements on the heat dissipation capacity of the radiator used to dissipate heat for chips. In addition, the demand for equipment miniaturization and compactness limits the space of the heat sink of the chip body, resulting in insufficient heat dissipation area of ​​the heat sink of the chip body. Therefore, the method of using the two-phase working medium to equalize the temperature and dissipate the heat to the remote space is gradually becoming popular, that is, the remote heat dissipation solution. [0003] LTS (loop thermosyphon) is an efficient remote ...

Claims

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Application Information

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IPC IPC(8): F28D15/02
CPCF28D15/0266
Inventor 张俊楠孙国顺宫海光惠晓卫
Owner HUAWEI TECH CO LTD
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