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Circuit board and preparation method thereof

A technology of circuit boards and circuit substrates, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc., can solve problems such as affecting the quality of circuit boards and the inability to effectively control circuit impedance, and achieve the effect of controlling impedance.

Inactive Publication Date: 2022-02-25
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, the impedance of the line cannot be effectively controlled, which affects the quality of the circuit board

Method used

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  • Circuit board and preparation method thereof
  • Circuit board and preparation method thereof
  • Circuit board and preparation method thereof

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Embodiment Construction

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application.

[0056] In order to further explain the technical means and effects adopted by the application to achieve the intend...

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Abstract

The invention provides a circuit board and a preparation method thereof. The circuit board comprises a base layer and a first circuit layer arranged on the surface of the base layer. The circuit board further comprises a first insulating layer and a second circuit layer. The first insulating layer is formed on the first circuit layer. And a first circuit slot and a second circuit slot are formed in the surface, far away from the first circuit layer, of the first insulating layer. And the depth of the second circuit slot is different from that of the first circuit slot. And the second circuit layer is filled in the first circuit slot and the second circuit slot. The purpose of effectively controlling impedance can be achieved.

Description

technical field [0001] The present application relates to the field of circuit board preparation, in particular to a circuit board and a preparation method thereof. Background technique [0002] Printed Circuit Board (PCB), as a support for electronic components, is an important part of electronic products. With the improvement of signal transmission speed and the wide application of high-frequency circuits, the reliability of signal transmission has become a key factor in the success of circuit board design. Therefore, in order to improve the reliability of signal transmission, higher requirements are put forward for the layout of circuit board lines. To achieve complete, reliable, and low-interference signal transmission, impedance control design is required along with layout of the circuit board. However, in the prior art, the impedance of the circuit cannot be effectively controlled, which affects the quality of the circuit board. Contents of the invention [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/42H05K1/18
CPCH05K3/4614H05K3/4652H05K3/423H05K3/425H05K1/186H05K1/188
Inventor 王胜辉
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD