Mechanical support within molded chip package

Abstract

The invention relates to a mechanical support within a molded chip package. The present disclosure describes an electronic component having a package body that includes a set of sidewalls and a bottom wall. One or more chip mounting elements extend from an inner surface of at least one sidewall into a space within the package, and at least one electronic chip is attached to the chip mounting elements. The electronic component also includes one or more reinforcement elements extending from an inner surface of one of the sidewalls to an outer surface of the bottom wall in a space within the package. The reinforcement elements are separated from the one or more chip mounting elements within the enclosed interior space.

Description

technical field [0001] The present disclosure relates to packages for electronic chips, and more particularly, to plastic packages formed by molding around electronic components. The present disclosure also relates to the mechanical properties of such packages. Background technique [0002] Electronic chips, which may also be referred to as dies, are typically prepared by fabricating various electronic structures on a substrate and dicing the substrate into chip-sized pieces. Each chip can then be placed within a protective encapsulation that forms an enclosure in which the chip is protected from the surrounding environment. The chip may be mechanically attached to a support structure inside the housing, such as a die pad, and electrically connected to contacts extending outside the housing. The packaged chip thus forms an electronic component that can be mounted on a circuit board. [0003] One method of making packaged electronic chips is to mold the package onto a lead...

AI Technical Summary

Problems solved by technology

The problem with this use of leadframes is that the contacts take up so much space that the package may have to be increased in size to accommodate all the contacts

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