Electronic device module, method of manufacturing electronic device module, and electronic apparatus
An electronic device and molding technology, which is applied in the fields of printed circuit manufacturing, electrical equipment construction parts, printed circuit assembly of electrical components, etc., can solve problems such as inability to mold and shield, difficult to card type application smart phones, etc.
Pending Publication Date: 2022-05-13
SAMSUNG ELECTRO MECHANICS CO LTD
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- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Card type is easier to implement than soldering, but due to space issues, it is difficult to apply card type to smartphones
[0005] In the WiFi module currently under development, double-sided mounting technology is applied to reduce the size, and even in this case, molding and shielding are performed on the upper surface after the components are mounted on both sides of the WiFi module, but Molding and shielding cannot be done on the bottom surface due to signal terminal handling issues
Method used
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[0046] The following detailed description is provided to assist the reader in gaining an overall understanding of the methods, devices and / or systems described herein. However, various changes, modifications and equivalents of the methods, apparatuses and / or systems described herein will become apparent after understanding the present disclosure. For example, the order of operations described herein is an example only and is not limited to the order set forth herein, but changes may be made that will be readily understood after understanding the present disclosure, except for operations that must occur in a specific order. Furthermore, descriptions of features that are known in the art may be omitted for increased clarity and conciseness.
[0047]The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the ma...
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The invention provides an electronic device module, a method of manufacturing the electronic device module, and an electronic apparatus. The electronic device module includes: a first plate having a first surface and a second surface facing opposite directions; the electronic devices are mounted on the first surface and the second surface respectively; a second plate coupled to the second surface and including a device accommodating portion accommodating a portion of the electronic devices, where the device accommodating portion is formed by an opening of the second plate; a first flexible printed circuit board including a first end portion and a second end portion disposed on opposite ends of the first flexible printed circuit board, where the first flexible printed circuit board is more flexible than the first board and the second board, and where the first end portion is integrally formed with the second board, and where the second end portion is integrally formed with the first board. A second plate electrically connected to one end of the second plate and extending to the outside of the second plate; and a first connector mounted on the second end portion.
Description
technical field [0001] The following description relates to a module with electronics mounted on a board and a method of manufacturing such a module. Background technique [0002] With the development of smart devices, the demand for personal electronics and portable electronics is increasing rapidly. In order to enhance portability while improving the functions and performance of smart devices, there are continuous demands to reduce the size and weight of electronic components embedded in such smart devices. [0003] With the technological development in the direction of reducing the individual size of mounted components, in order to achieve downsizing and weight reduction of electronic components, development of a technology of integrating a plurality of individual elements into a single electronic component has been simultaneously conducted. In addition, modules in the form of double-sided mount packages (components are provided on both sides of the module) are being dev...
Claims
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IPC IPC(8): H01L25/16H01L23/31H05K1/18H05K3/30
CPCH01L25/16H01L23/3128H05K1/181H05K3/301H05K2201/10007H05K2203/04H05K1/0243H05K1/147H05K3/361H05K3/284H05K2203/1316H05K3/4691H05K2201/09063H01L23/5389H01L23/4985H01L23/50H01L23/66H01L23/13H01L23/31H05K1/118H05K7/1053
Inventor 任星垣
Owner SAMSUNG ELECTRO MECHANICS CO LTD