Computer heat dissipation cooling system

Abstract

The invention relates to the related technical field of computer heat dissipation, and discloses a computer heat dissipation cooling system which comprises a case, the case is provided with an inner concave part, a mainboard carrying device is installed in the case, the mainboard carrying device comprises a mainboard installation plate, the mainboard installation plate is provided with a protruding plane part, and the protruding plane part is connected with the mainboard installation plate. Hollow heat dissipation grooves are formed in the convex plane part in an array mode, heat conduction metal blocks are arranged on the convex plane part in an array mode, functional heat dissipation grooves are formed in the inner side of the convex plane part, and the convex plane part penetrates through the mainboard mounting plate; according to the computer heat dissipation and cooling system, through the arrangement of efficient heat dissipation and cooling functions and the arrangement of the protruding plane parts and the functional heat dissipation groove internal structures, a certain space can be formed in the erecting position of the mainboard relative to the inner wall of the computer case, and therefore the air flowing efficiency of the peripheral side of the mainboard can be greatly improved; and the heat conduction metal block can be attached to the mainboard for heat conduction, so that solid conduction heat dissipation of the temperature of the mainboard is realized.

Description

technical field [0001] The invention relates to the related technical field of computer heat dissipation, in particular to a computer heat dissipation cooling system. Background technique [0002] A large number of integrated circuits are used in computer components. As we all know, the heat that causes high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. Most radiators absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distance through various methods, such as the air in the chassis, and then the chassis transmits the hot air to the outside of the chassis to complete the cooling of the computer. [0003] At present, the most common computer heat dissipation is air-cooled heat dissipation, and the most common device for air-cooled heat dissipation is the cooling fan. The existing traditional technology is not fully considered, and has the following disadvanta...

AI Technical Summary

Problems solved by technology

[0009] With the development of science and technology and the application of semiconductor materials, computer chips are now smaller in size and higher in performance. Computer motherboards are components for the main new performance structures of computers. The temperature of the motherboard will rise significantly, and it may not be possible to achieve a better heat dissipation effect in the computer case by only installing a radiator

Images