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Liquid cooling heat dissipation device and liquid cooling heat dissipation system for high-power chip

A liquid-cooled heat dissipation, high-power technology, applied in semiconductor/solid-state device parts, climate sustainability, semiconductor devices, etc., can solve the problems of poor liquid cooling and heat dissipation of high-power chips

Pending Publication Date: 2022-05-27
BIWIN STORAGE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to propose a liquid-cooled heat dissipation device for high-power chips, aiming to solve the technical problem that the current linear microchannel has poor liquid-cooled heat dissipation effect on high-power chips

Method used

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  • Liquid cooling heat dissipation device and liquid cooling heat dissipation system for high-power chip
  • Liquid cooling heat dissipation device and liquid cooling heat dissipation system for high-power chip
  • Liquid cooling heat dissipation device and liquid cooling heat dissipation system for high-power chip

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Embodiment Construction

[0023] The solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between various components under a certain posture (as shown in the accompanying drawings). The relative positional relationship, the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly.

[002...

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Abstract

The invention discloses a liquid cooling heat dissipation device for a high-power chip, the liquid cooling heat dissipation device comprises a liquid cooling substrate, a cooling liquid inlet and a cooling liquid outlet, the cooling liquid inlet and the cooling liquid outlet are arranged on the liquid cooling substrate, at least one liquid cooling channel group is arranged in the liquid cooling substrate, cooling liquid flows into the liquid cooling channel group from the cooling liquid inlet, and the cooling liquid flows into the liquid cooling channel group from the cooling liquid outlet. The cooling liquid flows out through the cooling liquid outlet; the liquid cooling channel group comprises a plurality of peach-shaped channels which are different in overall dimensions and are communicated with one another, and the centers of the peach-shaped channels coincide and are sequentially arranged from inside to outside according to the overall dimensions from small to large. The liquid cooling heat dissipation device is used for carrying out liquid cooling heat dissipation on the high-power chip, and the liquid cooling heat dissipation effect is good.

Description

technical field [0001] The invention relates to the technical field of chip semiconductor manufacturing, in particular to a liquid-cooled heat dissipation device and a liquid-cooled heat dissipation system for high-power chips. Background technique [0002] With the popularity of intelligence and the continuous growth of the semiconductor market, chips have been widely used in smart wearables, mobile phones, automotive electronics, desktop computers and other devices. Due to the miniaturization of electronic products, the integration of chips is getting higher and higher with Moore's Law, and a smaller package area ratio is pursued in embedded chip packaging, that is, more chips can be placed in a unit area. However, under high-density packaging, closely connected chips will generate greater thermal power consumption, resulting in a sharp rise in the temperature of electronic products, and high temperatures will reduce the reliability of electronic components, resulting in f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L23/367
CPCH01L23/473H01L23/367Y02D10/00
Inventor 孙成思孙日欣刘小刚黄健
Owner BIWIN STORAGE TECH CO LTD
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