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LED chip capable of emitting light from side

A LED chip and side-emitting technology, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of weakening the advantages of LED lamps, and achieve the effects of low cost, high uniformity of illumination, and high energy efficiency

Pending Publication Date: 2022-05-27
深圳禾只木装饰照明有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] To sum up, the use of LED lamps in the lighting field to improve the uniformity of illumination and solve glare is at the expense of energy, thus weakening the advantages of LED lamps in terms of energy saving and emission reduction.

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  • LED chip capable of emitting light from side
  • LED chip capable of emitting light from side
  • LED chip capable of emitting light from side

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Embodiment Construction

[0015] The content of the present invention will be further described below in conjunction with specific embodiments. It should be understood that these examples are only used to illustrate the present invention and not to limit the scope of the present invention. In addition, it should be understood that after reading the contents described in the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the limited scope of the present invention.

[0016] like figure 1 As shown, a side-emitting LED chip, the LED chip is a flip-chip LED chip, the LED chip includes an electrode layer 10, a semiconductor layer 20 and an epitaxial substrate layer 30, wherein the electrode layer 10 is arranged on the semiconductor layer 20. Below, the epitaxial substrate layer 30 is disposed above the semiconductor layer 20 , and the electrode layer 10 , the semiconductor layer 20 and the epitaxial ...

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Abstract

The invention relates to a side light emitting LED chip, the LED chip is a flip LED chip, the LED chip comprises an electrode layer, a semiconductor layer and an epitaxial substrate layer, the electrode layer is arranged below the semiconductor layer, the epitaxial substrate layer is arranged above the semiconductor layer, the electrode layer is arranged below the semiconductor layer, and the epitaxial substrate layer is arranged above the semiconductor layer. The electrode layer, the semiconductor layer and the epitaxial substrate layer are stacked together from bottom to top, an optical medium layer is arranged at the top of the epitaxial substrate layer, a light reflecting surface is formed at the top of the epitaxial substrate layer by means of the optical medium layer, and the light reflecting surface is located between the epitaxial substrate layer and the optical medium layer. The LED chip is provided with a lateral light-emitting surface, the lateral light-emitting surface is located on the periphery of the LED chip, light rays are generated in the semiconductor layer and penetrate upwards to enter the epitaxial substrate layer, and then the light rays are irradiated out from the lateral light-emitting surface after being reflected at the position of the light reflecting surface.

Description

technical field [0001] The present invention relates to an LED chip, in particular to a side-emitting LED chip. Background technique [0002] As we all know, LED has the advantages of high efficiency and energy saving, and it has been widely used in the field of lighting in recent years. [0003] However, because the light-emitting angle of the LED chip has a strong directionality, the light intensity in the direction perpendicular to the light-emitting surface of the LED chip is extremely high, so the light type of the current LED package device is a Lambertian distribution. This results in the high light intensity of the lamp using the LED package device in the direction perpendicular to the light-emitting surface of the lamp, and as the angle between the lamp and the vertical direction increases, the light intensity of the lamp is significantly attenuated. This characteristic of LED chips makes it difficult to improve the uniformity of illuminance when using LED lamps. A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/46H01L33/36
CPCH01L33/46H01L33/36
Inventor 叶华
Owner 深圳禾只木装饰照明有限公司
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