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Method for thermally treating substrates

A heat treatment method and heat treatment process technology, applied in the field of heat treatment of substrates, can solve problems such as unforeseen temperature and unevenness

Inactive Publication Date: 2007-04-18
聚斯微技术光掩膜设备有限责任两合公司
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  • Application Information

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Problems solved by technology

[0006] However, a problem with such a method is that it always only reacts to temperature inhomogeneities that have already occurred on the surface of the substrate in order to correct them afterwards by changing the nominal values ​​of the individual heating elements
One cannot foresee future temperature non-uniformities in the process
Moreover, problems that arise during one process, such as more severe temperature inhomogeneities at a certain temperature, are not taken into account in the process of the next substrate, because a predetermined target value distribution is again specified for these heating elements

Method used

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  • Method for thermally treating substrates

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Embodiment Construction

[0024] FIG. 1 is a schematic side view of a substrate heat treatment apparatus 1 .

[0025] The device 1 has a zone-controlled heating plate 2 consisting of a square base plate 3 with an approximately rectangular cross-section. The base plate 3 has a first planar top surface 5 and a segmented bottom surface 6 . The bottom surface 6 is divided into a total of 25 square regions 8 by four grooves 7 running perpendicularly to the sides of the heating plate. The depth of the groove 7 is approximately equal to half the thickness of the bottom plate 3 . On the square regions 8 of the heating plate 2 there are in each case square heating elements 10 which are suitably connected to the regions 8 of the base plate 3 , for example by gluing, and which together form the corresponding heating zones. By arranging the heating elements 10 on the regions 8 which are each separated by the slots 7 , these heating elements are thermally isolated from each other so that they do not influence eac...

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Abstract

To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.

Description

technical field [0001] The invention relates to a method for heat treatment of a substrate, wherein the substrate is heated by a plurality of independently controllable heating elements. Background technique [0002] For example, in the field of the semiconductor industry, such devices are used after the painting process of substrates, especially photomasks, to harden the substrate and heat-treat the chemically pretreated surface of the coating. In heat treatment, it is important for the subsequent usability of the substrate that the coating be treated as uniformly and consistently as possible. Here, however, the problem arises that, with consistent control of the heating element, it is not possible to process the substrate uniformly due to edge effects. It is therefore known that, at the start of the heat treatment, the heating elements in the peripheral regions of the substrate are heated to a lesser extent, since more material has to be heated first in the central region...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H05B3/00H01L21/02H01L21/027
CPCH01L21/67248H01L21/027
Inventor J·塞克雷施P·德雷斯U·迪策W·绍勒
Owner 聚斯微技术光掩膜设备有限责任两合公司
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