Method and device for dividing brittle substrate

Abstract

The present invention relates to a method and a device for dividing brittle substrate. The device comprises a splitting pole for pressing the lineate brittle substrate to execute splitting along the scratch. The device is characterized in that the bottom of the splitting pole is provided with a curved shaped pressing part; a pressing control part is provided for bringing the curved shaped pressing part into contact with the surface of the brittle substrate along the splitting predetermined line with respect to the scratch, at the same time horizontally moving along the long edge direction of the splitting pole. The utility model method and apparatus are used where the undesirable parts on the ends of the cell substrates are retained. After cutting of the laminated glass substrate, another device is used to cut off the undesirable parts. Thus in the process of cutting a laminated glass substrate of a large size into a plurality of cell substrate of a small size while cutting off undesirable parts from the glass substrate, the forming of fragments on the glass ends can be prevented.

Description

technical field [0001] The invention relates to a method for dividing a brittle substrate and a device for dividing the brittle substrate. Background technique [0002] figure 1 It is a schematic diagram of a dividing device for a brittle substrate generally used in the past. A brittle substrate 1 formed with a scribe-line S is mounted on a stage 3 via a mat 2 . The split rod 4 is located above the brittle substrate 1, and the split rod 4 is bonded with a hard rubber 4b with a V-shaped cross section under the rod-shaped metal member 4a. When the lower end of the hard rubber 4b is aligned with the engraved line S and pressed from above, the brittle substrate 1 is slightly bent on the mat 2 and divided along the engraved line S. [0003] figure 2 is a front view of the dividing rod 4 . The length L of the dividing rod must be substantially equal to the lateral width of the brittle substrate 1 , so when the brittle substrate 1 is of a large size, the length L of the divid...

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Problems solved by technology

Then, there are unevennesses on the hard rubber 4b, and phenomena such as bending of the dividing rod 4 and the brittle substrate 1 will occur. Therefore, the existing method is to press the hard rubber 4b on the brittle substrate 1 after contacting it in a straight line without gaps. , the uniform splitting pressure will not act on the glass plate 1 during splitting, and bad splitting will easily occur

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